Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: 8413202YB

8413202YB ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.305 INCHES NOMINAL IN, body_height: 0.120 INCHES NOMINAL IN, body_length: 0.440 INCHES NOMINAL IN, memory_capacity: 16K X 1, features_provided: ELECTROSTATIC SENSITIVE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-296-2266, indicating validated use in U.S.

government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

8413202YB

NSN: 5962-01-296-2266
FSC: 5962
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)

SPECIFICATIONS

body_width	0.305 INCHES NOMINAL IN
body_height	0.120 INCHES NOMINAL IN
body_length	0.440 INCHES NOMINAL IN
memory_capacity	16K X 1
features_provided	ELECTROSTATIC SENSITIVE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	17 INPUT
NSN	5962-01-296-2266

COMPONENT DIAGRAM

KEY FEATURES

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OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC

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FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/ENABLE

•

BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN

•

OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC

•

MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS

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CURRENT RATING PER CHARACTERISTIC: 50.00 MILLIAMPERES NOMINAL TOTAL SUPPLY

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE

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CASE OUTLINE SOURCE AND DESIGNATOR: C-13 MIL-M-38510

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/ENABLE
BODY HEIGHT	0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
MAXIMUM POWER DISSIPATION RATING	1.0 WATTS
CURRENT RATING PER CHARACTERISTIC	50.00 MILLIAMPERES NOMINAL TOTAL SUPPLY
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	7.0 VOLTS MAXIMUM POWER SOURCE
CASE OUTLINE SOURCE AND DESIGNATOR	C-13 MIL-M-38510
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
TERMINAL SURFACE TREATMENT	SOLDER

VERIFIED SUBSTITUTES & CROSS-REFERENCES 31

114604Interchangeable