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Technical Data Sheet
PartsTable / COMPONENT / 312A3435P2
312A3435P2 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.280 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN, body_height: 0.055 INCHES MINIMUM AND 0.075 INCHES MAXIMUM IN, body_length: 0.415 INCHES MINIMUM AND 0.435 INCHES MAXIMUM IN, features_provided: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/ENABLE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-287-2397, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
312A3435P2
NSN: 5962-01-287-2397
FSC: 5962
CAGE: 89954 — BAE SYSTEMS CONTROLS INC. (USA)
SPECIFICATIONS
body_width0.280 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
body_height0.055 INCHES MINIMUM AND 0.075 INCHES MAXIMUM IN
body_length0.415 INCHES MINIMUM AND 0.435 INCHES MAXIMUM IN
features_providedELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/ENABLE
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeRAM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern17 INPUT
inclosure_configurationLEADLESS FLAT PACK
NSN5962-01-287-2397
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 312A3435P2 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS
•
MEMORY DEVICE TYPE: RAM
•
TIME RATING PER CHACTERISTIC: 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
•
TERMINAL SURFACE TREATMENT: SOLDER
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE
•
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
•
TERMINAL TYPE AND QUANTITY: 20 LEADLESS
•
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
MAXIMUM POWER DISSIPATION RATING1.0 WATTS
MEMORY DEVICE TYPERAM
TIME RATING PER CHACTERISTIC35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
TERMINAL SURFACE TREATMENTSOLDER
VOLTAGE RATING AND TYPE PER CHARACTERISTIC7.0 VOLTS MAXIMUM POWER SOURCE
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
TERMINAL TYPE AND QUANTITY20 LEADLESS
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
INCLOSURE CONFIGURATIONLEADLESS FLAT PACK
BODY LENGTH0.415 INCHES MINIMUM AND 0.435 INCHES MAXIMUM IN
VERIFIED SUBSTITUTES & CROSS-REFERENCES 27
114604Interchangeable
interchangeable cross-reference
interchangeable
0914105-2Interchangeable
interchangeable cross-reference
interchangeable
BEAX7FInterchangeable
interchangeable cross-reference
interchangeable
CY7C167-45LMBInterchangeable
interchangeable cross-reference
interchangeable
IDT6167SA45LBInterchangeable
interchangeable cross-reference
interchangeable
8413202YBInterchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 312A3435P2?
312A3435P2 is a MICROCIRCUIT,MEMORY.
What parts can replace 312A3435P2?
There are 27 known substitutes for 312A3435P2: 114604, 0914105-2, BEAX7F and 24 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 312A3435P2?
312A3435P2 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-287-2397. This indicates validated use in U.S. government and defense supply chains.
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Last verified: July 2026