82S191F — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

82S191F: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.515 INCHES MINIMUM AND 0.550 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.190 INCHES MAXIMUM IN, body_length: 1.235 INCHES MINIMUM AND 1.290 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: PROGRAMMABLE AND SCHOTTKY AND BIPOLAR, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-166-3805, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

82S191F

NSN: 5962-01-166-3805
NIINs: 011663805, 011905202
FSC: 5962 — Microcircuits, Electronic
CAGE: 18324 — PHILIPS SEMICONDUCTORS INC (USA)

SPECIFICATIONS

body_width	0.515 INCHES MINIMUM AND 0.550 INCHES MAXIMUM IN
body_height	0.140 INCHES MINIMUM AND 0.190 INCHES MAXIMUM IN
body_length	1.235 INCHES MINIMUM AND 1.290 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	PROGRAMMABLE AND SCHOTTKY AND BIPOLAR
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 75.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-166-3805

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 12 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.580 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.160 INCHES MAXIMUM IN

•

FEATURES PROVIDED: PROGRAMMED

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: PROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	12 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.580 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
BODY HEIGHT	0.160 INCHES MAXIMUM IN
FEATURES PROVIDED	PROGRAMMED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	PROM
BODY LENGTH	1.380 INCHES MINIMUM AND 1.430 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 4

7606-0821Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

7606-0821-1Reference document

Same NSN cross-reference

Reference document — Design control — primary reference

SC5962-0546-1Reference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 82S191F?

82S191F is a MICROCIRCUIT,MEMORY.

What parts can replace 82S191F?

There are 4 known substitutes for 82S191F: 7606-0821, 7606-0821-1, SC5962-0546-1 and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 82S191F?

82S191F is cataloged in the U.S. Government catalog under NSN 5962-01-166-3805. This indicates validated use in U.S. government and defense supply chains.

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