7606-0821 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

7606-0821: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.580 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.160 INCHES MAXIMUM IN, body_length: 1.380 INCHES MINIMUM AND 1.430 INCHES MAXIMUM IN, features_provided: PROGRAMMED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-166-3805, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

7606-0821

NSN: 5962-01-166-3805
FSC: 5962 — Microcircuits, Electronic
CAGE: 59475 — REX SYSTEMS INCORPORATED DBA REX SYSTEMS INC (USA)

SPECIFICATIONS

body_width	0.580 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height	0.160 INCHES MAXIMUM IN
body_length	1.380 INCHES MINIMUM AND 1.430 INCHES MAXIMUM IN
features_provided	PROGRAMMED
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	12 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-166-3805

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 12 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.580 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.160 INCHES MAXIMUM IN

•

FEATURES PROVIDED: PROGRAMMED

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: PROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	12 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.580 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
BODY HEIGHT	0.160 INCHES MAXIMUM IN
FEATURES PROVIDED	PROGRAMMED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	PROM
BODY LENGTH	1.380 INCHES MINIMUM AND 1.430 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 4

7606-0821-1Reference document

Same NSN cross-reference

Reference document — Design control — primary reference

82S191FReference document

Same NSN cross-reference

Reference document — Secondary reference

SC5962-0546-1Reference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 7606-0821?

7606-0821 is a MICROCIRCUIT,MEMORY.

What parts can replace 7606-0821?

There are 4 known substitutes for 7606-0821: 7606-0821-1, 82S191F, SC5962-0546-1 and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 7606-0821?

7606-0821 is cataloged in the U.S. Government catalog under NSN 5962-01-166-3805. This indicates validated use in U.S. government and defense supply chains.

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