82S18/BKA — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

82S18/BKA: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.400 INCHES MAXIMUM IN, body_height: 0.085 INCHES MAXIMUM IN, body_length: 0.625 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND PROGRAMMABLE AND 3-STATE OUTPUT, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-176-3758, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

82S18/BKA

NSN: 5962-01-176-3758
FSC: 5962 — Microcircuits, Electronic
CAGE: 18324 — PHILIPS SEMICONDUCTORS INC (USA)

SPECIFICATIONS

body_width	0.400 INCHES MAXIMUM IN
body_height	0.085 INCHES MAXIMUM IN
body_length	0.625 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND PROGRAMMABLE AND 3-STATE OUTPUT
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
inclosure_configuration	FLAT PACK
terminal_surface_treatment	SOLDER
NSN	5962-01-176-3758

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.400 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.085 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC AND PROGRAMMABLE AND 3-STATE OUTPUT

•

INCLOSURE CONFIGURATION: FLAT PACK

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.400 INCHES MAXIMUM IN
BODY HEIGHT	0.085 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC AND PROGRAMMABLE AND 3-STATE OUTPUT
INCLOSURE CONFIGURATION	FLAT PACK
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.625 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 4

6133402-4Reference document

Same NSN cross-reference

Reference document — Secondary reference

6134896-6Reference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

ROM/PROM FAMILY 112Reference document

Same NSN cross-reference

Reference document — Secondary reference

93451FMQBReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 82S18/BKA?

82S18/BKA is a MICROCIRCUIT,MEMORY.

What parts can replace 82S18/BKA?

There are 4 known substitutes for 82S18/BKA: 6133402-4, 6134896-6, ROM/PROM FAMILY 112 and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 82S18/BKA?

82S18/BKA is cataloged in the U.S. Government catalog under NSN 5962-01-176-3758. This indicates validated use in U.S. government and defense supply chains.

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