8200801JA: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, overall_height: 0.425 INCHES MAXIMUM IN, overall_length: 1.290 INCHES MAXIMUM IN, memory_capacity: UNKNOWN. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-196-6113, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN |
| body_height | 0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN |
| body_length | 1.290 INCHES MAXIMUM IN |
| overall_height | 0.425 INCHES MAXIMUM IN |
| overall_length | 1.290 INCHES MAXIMUM IN |
| memory_capacity | UNKNOWN |
| features_provided | BIPOLAR AND PROGRAMMED AND SCHOTTKY |
| output_logic_form | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
| inclosure_material | CERAMIC |
| memory_device_type | PROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| NSN | 5962-01-196-6113 |
| INPUT CIRCUIT PATTERN | 14 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.210 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIPOLAR AND PROGRAMMABLE |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CURRENT RATING PER CHARACTERISTIC | 100.00 MILLIAMPERES NOMINAL OUTPUT |
| MEMORY DEVICE TYPE | ROM |
| CASE OUTLINE SOURCE AND DESIGNATOR | D-3 MIL-M-38510 |