8200502YX — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

8200502YX: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.610 INCHES MAXIMUM IN, body_height: 0.217 INCHES MAXIMUM IN, body_length: 1.490 INCHES MAXIMUM IN, bit_quantity: 65536, word_quantity: 8192, memory_capacity: 8K X 8. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-218-5698, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

8200502YX

NSN: 5962-01-218-5698
NIINs: 012185698, 012185699, 015132656, 015133076, 015140053, 015140058, 015226511, 015226529, 015227379, 015227394, 015234919, 015234922
FSC: 5962 — Microcircuits, Electronic
CAGE: 16236 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (VENDOR ITEM DRAWINGS) (USA)

SPECIFICATIONS

body_width	0.610 INCHES MAXIMUM IN
body_height	0.217 INCHES MAXIMUM IN
body_length	1.490 INCHES MAXIMUM IN
bit_quantity	65536
word_quantity	8192
memory_capacity	8K X 8
special_features	UV ERASEABLE PROM
features_provided	ELECTROSTATIC SENSITIVE AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND HERMETICALLY SEALED
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	EPROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
NSN	5962-01-218-5698

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 16 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.560 INCHES MINIMUM AND 0.625 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.217 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC AND ULTRAVIOLET ERASABLE AND HERMETICALLY SEALED AND PROGRAMMABLE AND ELECTROSTATIC SENSITIVE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	16 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.560 INCHES MINIMUM AND 0.625 INCHES MAXIMUM IN
BODY HEIGHT	0.217 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC AND ULTRAVIOLET ERASABLE AND HERMETICALLY SEALED AND PROGRAMMABLE AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.485 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 4

477-1947-001Reference document

Same NSN cross-reference

Reference document — Secondary reference

2L018-0237Reference document

Same NSN cross-reference

Reference document — Secondary reference

477-1950-017Reference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROM FAMILY 040Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 8200502YX?

8200502YX is a MICROCIRCUIT,DIGITAL.

What parts can replace 8200502YX?

There are 4 known substitutes for 8200502YX: 477-1947-001, 2L018-0237, 477-1950-017 and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 8200502YX?

8200502YX is cataloged in the U.S. Government catalog under NSN 5962-01-218-5698. This indicates validated use in U.S. government and defense supply chains.

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