2L018-0237 — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

2L018-0237: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.560 INCHES MINIMUM AND 0.625 INCHES MAXIMUM IN, body_height: 0.217 INCHES MAXIMUM IN, body_length: 1.485 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND ULTRAVIOLET ERASABLE AND HERMETICALLY SEALED AND PROGRAMMABLE AND ELECTROSTATIC SENSITIVE, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-218-5698, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

2L018-0237

NSN: 5962-01-218-5698
FSC: 5962 — Microcircuits, Electronic
CAGE: 94756 — THE BOEING COMPANY DIV LEGACY BOEING HB1 (USA)

SPECIFICATIONS

body_width	0.560 INCHES MINIMUM AND 0.625 INCHES MAXIMUM IN
body_height	0.217 INCHES MAXIMUM IN
body_length	1.485 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND ULTRAVIOLET ERASABLE AND HERMETICALLY SEALED AND PROGRAMMABLE AND ELECTROSTATIC SENSITIVE
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	16 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-218-5698

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 16 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.560 INCHES MINIMUM AND 0.625 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.217 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC AND ULTRAVIOLET ERASABLE AND HERMETICALLY SEALED AND PROGRAMMABLE AND ELECTROSTATIC SENSITIVE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	16 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.560 INCHES MINIMUM AND 0.625 INCHES MAXIMUM IN
BODY HEIGHT	0.217 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC AND ULTRAVIOLET ERASABLE AND HERMETICALLY SEALED AND PROGRAMMABLE AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.485 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 4

8200502YXReference document

Same NSN cross-reference

Reference document — Secondary reference

477-1947-001Reference document

Same NSN cross-reference

Reference document — Secondary reference

477-1950-017Reference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROM FAMILY 040Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 2L018-0237?

2L018-0237 is a MICROCIRCUIT,DIGITAL.

What parts can replace 2L018-0237?

There are 4 known substitutes for 2L018-0237: 8200502YX, 477-1947-001, 477-1950-017 and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 2L018-0237?

2L018-0237 is cataloged in the U.S. Government catalog under NSN 5962-01-218-5698. This indicates validated use in U.S. government and defense supply chains.

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2L018-0237 — MICROCIRCUIT,DIGITAL

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