PartsTable
Technical Data Sheet
PartsTable / COMPONENT / 8000550-401
8000550-401 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.280 INCHES MAXIMUM IN, body_height: 0.165 INCHES MINIMUM AND 0.215 INCHES MAXIMUM IN, body_length: 0.985 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND PROGRAMMABLE AND W/ENABLE AND W/BUFFERED OUTPUT, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-170-2973, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
8000550-401
NSN: 5962-01-170-2973
FSC: 5962
CAGE: 07187 — HONEYWELL INTERNATIONAL INC. DBA HONEYWELL INTERNATIONAL (USA)
SPECIFICATIONS
body_width0.280 INCHES MAXIMUM IN
body_height0.165 INCHES MINIMUM AND 0.215 INCHES MAXIMUM IN
body_length0.985 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND PROGRAMMABLE AND W/ENABLE AND W/BUFFERED OUTPUT
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern10 INPUT
end_item_identification6615-01-160-3477
inclosure_configurationDUAL-IN-LINE
NSN5962-01-170-2973
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 8000550-401 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
FEATURES PROVIDED: HERMETICALLY SEALED AND PROGRAMMABLE AND W/ENABLE AND W/BUFFERED OUTPUT
•
INCLOSURE MATERIAL: CERAMIC
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
•
TERMINAL SURFACE TREATMENT: SOLDER
•
TIME RATING PER CHACTERISTIC: 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
•
MEMORY DEVICE TYPE: ROM
•
TERMINAL TYPE AND QUANTITY: 20 PRINTED CIRCUIT
•
INPUT CIRCUIT PATTERN: 10 INPUT
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
FEATURES PROVIDEDHERMETICALLY SEALED AND PROGRAMMABLE AND W/ENABLE AND W/BUFFERED OUTPUT
INCLOSURE MATERIALCERAMIC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
TERMINAL SURFACE TREATMENTSOLDER
TIME RATING PER CHACTERISTIC75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
MEMORY DEVICE TYPEROM
TERMINAL TYPE AND QUANTITY20 PRINTED CIRCUIT
INPUT CIRCUIT PATTERN10 INPUT
BODY WIDTH0.280 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
VERIFIED SUBSTITUTES & CROSS-REFERENCES 19
803838-1Interchangeable
interchangeable cross-reference
interchangeable
ROM/PROM FAMILY 023Interchangeable
interchangeable cross-reference
interchangeable
54S472Interchangeable
interchangeable cross-reference
interchangeable
2357242-20Interchangeable
interchangeable cross-reference
interchangeable
DH75638Interchangeable
interchangeable cross-reference
interchangeable
ROM/PROMInterchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
Ready to buy 8000550-401?
Compare prices from verified sellers on eBay
Buy on eBay →
As an eBay Partner, PartsTable may earn a commission. Your price is not affected.
FREQUENTLY ASKED QUESTIONS
What is 8000550-401?
8000550-401 is a MICROCIRCUIT,MEMORY.
What parts can replace 8000550-401?
There are 19 known substitutes for 8000550-401: 803838-1, ROM/PROM FAMILY 023, 54S472 and 16 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 8000550-401?
8000550-401 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-170-2973. This indicates validated use in U.S. government and defense supply chains.
Community Feedback
Comments (0)
No comments yet. Be the first to share what you know.
Leave a Comment
Comments are reviewed before appearing. You will receive an email to verify before your comment appears.

Request a Quote — 8000550-401

✓ Validated with multiple authoritative sources, including Government, OEM, and Certified sources.
PartsTable Design LLC · partstable.com
Last verified: July 2026