Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: 803838-1

803838-1 ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN, body_height: 0.150 INCHES MAXIMUM IN, body_length: 0.930 INCHES MINIMUM AND 0.975 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE AND PROGRAMMED AND SCHOTTKY AND 3-STATE OUTPUT, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-103-6125, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

803838-1

NSN: 5962-01-103-6125
FSC: 5962
CAGE: 96214 — RAYTHEON COMPANY DBA RAYTHEON (USA)

SPECIFICATIONS

body_width	0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
body_height	0.150 INCHES MAXIMUM IN
body_length	0.930 INCHES MINIMUM AND 0.975 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE AND PROGRAMMED AND SCHOTTKY AND 3-STATE OUTPUT
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-103-6125

COMPONENT DIAGRAM

KEY FEATURES

•

BODY HEIGHT: 0.150 INCHES MAXIMUM IN

•

INPUT CIRCUIT PATTERN: 10 INPUT

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STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

•

FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE AND PROGRAMMED AND SCHOTTKY AND 3-STATE OUTPUT

•

TERMINAL SURFACE TREATMENT: SOLDER

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TERMINAL TYPE AND QUANTITY: 20 PRINTED CIRCUIT

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MEMORY DEVICE TYPE: ROM

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VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -1.2 VOLTS MAXIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

BODY HEIGHT	0.150 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN	10 INPUT
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE AND PROGRAMMED AND SCHOTTKY AND 3-STATE OUTPUT
TERMINAL SURFACE TREATMENT	SOLDER
TERMINAL TYPE AND QUANTITY	20 PRINTED CIRCUIT
MEMORY DEVICE TYPE	ROM
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	-1.2 VOLTS MAXIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
BODY LENGTH	0.930 INCHES MINIMUM AND 0.975 INCHES MAXIMUM IN

VERIFIED SUBSTITUTES & CROSS-REFERENCES 15

ROM/PROM FAMILY 023Interchangeable