795072-1: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.458 INCHES MAXIMUM IN, body_height: 0.120 INCHES MAXIMUM IN, body_length: 0.560 INCHES MAXIMUM IN, features_provided: BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-274-7052, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.458 INCHES MAXIMUM IN |
| body_height | 0.120 INCHES MAXIMUM IN |
| body_length | 0.560 INCHES MAXIMUM IN |
| features_provided | BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | ROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 16 INPUT |
| end_item_identification | F/A-18 HORNET AIRCRAFT |
| NSN | 5962-01-274-7052 |
| INPUT CIRCUIT PATTERN | 16 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.458 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.120 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND W/ENABLE AND ELECTROSTATIC SENSITIVE |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| MEMORY DEVICE TYPE | ROM |
| BODY LENGTH | 0.560 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 125.0 CELSIUS DEGC |