The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include features_provided: PROGRAMMABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: PAL, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, test_data_document: 73030-HS11614 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-334-9825, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| features_provided | PROGRAMMABLE |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | PAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 73030-HS11614 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 12 INPUT |
| end_item_identification | A/F-18-DCN E/I FSCM 73030 |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 20 PRINTED CIRCUIT |
| NSN | 5962-01-334-9825 |
| TERMINAL SURFACE TREATMENT | SOLDER |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
| INPUT CIRCUIT PATTERN | 12 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| FEATURES PROVIDED | BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| DESIGN FUNCTION AND QUANTITY | 1 PROCESSOR, PULSE |