Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: 2802845-0001

2802845-0001 ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, body_height: 0.064 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN, body_length: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, features_provided: HIGH SPEED AND HIGH PERFORMANCE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-276-4796, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

2802845-0001

NSN: 5962-01-276-4796
FSC: 5962
CAGE: 96214 — RAYTHEON COMPANY DBA RAYTHEON (USA)

SPECIFICATIONS

body_width	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
body_height	0.064 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN
body_length	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
features_provided	HIGH SPEED AND HIGH PERFORMANCE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	8 INPUT
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
NSN	5962-01-276-4796

COMPONENT DIAGRAM

KEY FEATURES

•

MEMORY DEVICE TYPE: PAL

•

INPUT CIRCUIT PATTERN: 8 INPUT

•

FEATURES PROVIDED: HIGH SPEED AND HIGH PERFORMANCE

•

INCLOSURE MATERIAL: CERAMIC

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE

•

OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC

•

TERMINAL TYPE AND QUANTITY: 20 LEADLESS

•

TIME RATING PER CHACTERISTIC: 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

MEMORY DEVICE TYPE	PAL
INPUT CIRCUIT PATTERN	8 INPUT
FEATURES PROVIDED	HIGH SPEED AND HIGH PERFORMANCE
INCLOSURE MATERIAL	CERAMIC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	7.0 VOLTS MAXIMUM POWER SOURCE
OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC
TERMINAL TYPE AND QUANTITY	20 LEADLESS
TIME RATING PER CHACTERISTIC	40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
BODY LENGTH	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN

VERIFIED SUBSTITUTES & CROSS-REFERENCES 11

AMPAL16R4L/B2AInterchangeable