77A111328P001 — Technical Data Sheet

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— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, body_height: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, body_length: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMED AND ELECTROSTATIC SENSITIVE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-361-0692, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

77A111328P001

NSN: 5962-01-361-0692
FSC: 5962
CAGE: 03538 — LOCKHEED MARTIN CORPORATION DIV RMS (USA)

SPECIFICATIONS

body_width	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
body_height	0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
body_length	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMED AND ELECTROSTATIC SENSITIVE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	16 INPUT
inclosure_configuration	LEADLESS FLAT PACK
NSN	5962-01-361-0692

COMPONENT DIAGRAM

KEY FEATURES

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OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC

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INCLOSURE MATERIAL: CERAMIC

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TERMINAL TYPE AND QUANTITY: 20 LEADLESS

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VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.5 VOLTS MINIMUM POWER SOURCE AND 12.0 VOLTS MAXIMUM POWER SOURCE

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INPUT CIRCUIT PATTERN: 16 INPUT

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MEMORY DEVICE TYPE: PAL

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OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC

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TERMINAL SURFACE TREATMENT: SOLDER

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC
INCLOSURE MATERIAL	CERAMIC
TERMINAL TYPE AND QUANTITY	20 LEADLESS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	-0.5 VOLTS MINIMUM POWER SOURCE AND 12.0 VOLTS MAXIMUM POWER SOURCE
INPUT CIRCUIT PATTERN	16 INPUT
MEMORY DEVICE TYPE	PAL
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
TERMINAL SURFACE TREATMENT	SOLDER
BODY HEIGHT	0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
PART NAME ASSIGNED BY CONTROLLING AGENCY	AND-OR INVERT GATE ARRAY

VERIFIED SUBSTITUTES & CROSS-REFERENCES 9

85065012BInterchangeable