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Technical Data Sheet
PartsTable / COMPONENT / 7103806-002
7103806-002 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, overall_height: 0.400 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-340-9356, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
7103806-002
NSN: 5962-01-340-9356
FSC: 5962
CAGE: 93322 — GE AVIATION SYSTEMS LLC DBA GE AVIATION (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length1.060 INCHES MAXIMUM IN
overall_height0.400 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMED
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePAL
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern14 INPUT
NSN5962-01-340-9356
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 7103806-002 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
•
TERMINAL SURFACE TREATMENT: SOLDER
•
TERMINAL TYPE AND QUANTITY: 20 PRINTED CIRCUIT
•
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
•
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
•
TIME RATING PER CHACTERISTIC: 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMED
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
BODY WIDTH0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
TERMINAL SURFACE TREATMENTSOLDER
OVERALL HEIGHT0.400 INCHES MAXIMUM IN
TERMINAL TYPE AND QUANTITY20 PRINTED CIRCUIT
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
TIME RATING PER CHACTERISTIC75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMED
CURRENT RATING PER CHARACTERISTIC100.00 MILLIAMPERES MAXIMUM OUTPUT SINK
CASE OUTLINE SOURCE AND DESIGNATORD-8 MIL-M-38510
VERIFIED SUBSTITUTES & CROSS-REFERENCES 19
85065Interchangeable
interchangeable cross-reference
interchangeable
8506504RBInterchangeable
interchangeable cross-reference
interchangeable
8506504RAInterchangeable
interchangeable cross-reference
interchangeable
2906941-1Interchangeable
interchangeable cross-reference
interchangeable
ROM/PROM FAMILY 184Interchangeable
interchangeable cross-reference
interchangeable
7110320-001Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 7103806-002?
7103806-002 is a MICROCIRCUIT,MEMORY.
What parts can replace 7103806-002?
There are 19 known substitutes for 7103806-002: 85065, 8506504RB, 8506504RA and 16 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 7103806-002?
7103806-002 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-340-9356. This indicates validated use in U.S. government and defense supply chains.
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✓ Validated with multiple authoritative sources, including Government, OEM, and Certified sources.
PartsTable Design LLC · partstable.com
Last verified: July 2026