The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include weight: 21.000 OUNCES OZ, material: SILICON SEMICONDUCTOR, thickness: 1.1 MILLIMETERS NOMINAL MM, head_length: 5.188 INCHES NOMINAL IN, face_diameter: 1.750 INCHES NOMINAL IN, overall_length: 12.125 INCHES NOMINAL IN. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-081-6392, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| weight | 21.000 OUNCES OZ |
| material | SILICON SEMICONDUCTOR |
| thickness | 1.1 MILLIMETERS NOMINAL MM |
| head_length | 5.188 INCHES NOMINAL IN |
| face_diameter | 1.750 INCHES NOMINAL IN |
| overall_length | 12.125 INCHES NOMINAL IN |
| mounting_method | TERMINAL |
| terminal_length | 1.350 INCHES MAXIMUM IN |
| overall_diameter | 0.225 INCHES MAXIMUM IN |
| special_features | DEAD BLOW; URETHANE COATED HEAD, HANDLE AND FACES |
| style_designator | SOFT-HEAD |
| features_provided | HERMETICALLY SEALED CASE |
| NSN | 5961-00-081-6392 |
| MATERIAL | SILICON SEMICONDUCTOR |
| CURRENT RATING PER CHARACTERISTIC | 30.00 AMPERES MAXIMUM AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 100.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| TERMINAL LENGTH | 1.350 INCHES MAXIMUM IN |
| MOUNTING METHOD | TERMINAL |
| OVERALL DIAMETER | 0.225 INCHES MAXIMUM IN |
| OVERALL LENGTH | 0.350 INCHES MAXIMUM IN |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 175.0 CELSIUS AMBIENT AIR DEGC |
| MATERIAL | GLASS ENCLOSURE |