The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: GLASS ENCLOSURE, overall_length: 0.570 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 1.000 INCHES MINIMUM IN, overall_diameter: 0.250 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-114-0590, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | GLASS ENCLOSURE |
| overall_length | 0.570 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 1.000 INCHES MINIMUM IN |
| overall_diameter | 0.250 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED CASE |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| current_rating_per_characteristic | 750.00 MILLIAMPERES MAXIMUM FORWARD CURRENT, DC |
| voltage_rating_in_volts_per_characteristic | 100.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| NSN | 5961-00-114-0590 |
| MATERIAL | GLASS ENCLOSURE |
| TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 100.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| OVERALL DIAMETER | 0.250 INCHES MAXIMUM IN |
| OVERALL LENGTH | 0.570 INCHES MAXIMUM IN |
| MOUNTING METHOD | TERMINAL |
| CURRENT RATING PER CHARACTERISTIC | 750.00 MILLIAMPERES MAXIMUM FORWARD CURRENT, DC |
| TERMINAL LENGTH | 1.000 INCHES MINIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| MATERIAL | SILICON SEMICONDUCTOR |