642AS7888 — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

642AS7888: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.200 INCHES MAXIMUM IN, body_height: 0.075 INCHES MAXIMUM IN, body_length: 0.380 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND EDGE TRIGGERED AND HIGH SPEED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-076-8394, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

642AS7888

NSN: 5962-01-076-8394
FSC: 5962 — Microcircuits, Electronic
CAGE: 30003 — NAVAL AIR SYSTEMS COMMAND MANAGED ORIGINAL DESIGN ACTIVITY NOT MATERIAL/PARTS SUPPLIER (USA)

SPECIFICATIONS

body_width	0.200 INCHES MAXIMUM IN
body_height	0.075 INCHES MAXIMUM IN
body_length	0.380 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND EDGE TRIGGERED AND HIGH SPEED
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	4 INPUT
end_item_identification	GUIDANCE UNIT,MIDCOURSE,TYPE CP-1137/DSQ-28
inclosure_configuration	FLAT PACK
terminal_surface_treatment	SOLDER
NSN	5962-01-076-8394

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 4 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 2 FLIP-FLOP, D-TYPE

•

BODY WIDTH: 0.200 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.075 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND EDGE TRIGGERED AND HIGH SPEED

•

INCLOSURE CONFIGURATION: FLAT PACK

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	4 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	2 FLIP-FLOP, D-TYPE
BODY WIDTH	0.200 INCHES MAXIMUM IN
BODY HEIGHT	0.075 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND EDGE TRIGGERED AND HIGH SPEED
INCLOSURE CONFIGURATION	FLAT PACK
BODY LENGTH	0.380 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 4

5962PL1258505Reference document

Same NSN cross-reference

Reference document — Informative reference only

DMS 85076BReference document

Same NSN cross-reference

Reference document — Secondary reference

SN54H74WReference document

Same NSN cross-reference

Reference document — Secondary reference

6088474-1Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 642AS7888?

642AS7888 is a MICROCIRCUIT,DIGITAL.

What parts can replace 642AS7888?

There are 4 known substitutes for 642AS7888: 5962PL1258505, DMS 85076B, SN54H74W and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 642AS7888?

642AS7888 is cataloged in the U.S. Government catalog under NSN 5962-01-076-8394. This indicates validated use in U.S. government and defense supply chains.

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642AS7888 — MICROCIRCUIT,DIGITAL

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