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Technical Data Sheet
PartsTable / COMPONENT / 635A327H04
635A327H04 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.294 INCHES MAXIMUM IN, body_height: 0.139 INCHES MINIMUM AND 0.204 INCHES MAXIMUM IN, body_length: 0.808 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-047-6648, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
635A327H04
NSN: 5962-01-047-6648
FSC: 5962
CAGE: 97942 — NORTHROP GRUMMAN SYSTEMS CORPORATION DBA NORTHROP GRUMMAN SYSTEMS CORP (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.294 INCHES MAXIMUM IN
body_height0.139 INCHES MINIMUM AND 0.204 INCHES MAXIMUM IN
body_length0.808 INCHES MAXIMUM IN
memory_capacityUNKNOWN
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC AND GLASS
memory_device_typePROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern6 INPUT
end_item_identificationRADAR SET,TYPE AN/TPS-43E
inclosure_configurationDUAL-IN-LINE
NSN5962-01-047-6648
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 635A327H04 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
FEATURES PROVIDED: BIPOLAR AND HERMETICALLY SEALED AND HIGH SPEED AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMED AND W/BUFFERED OUTPUT AND W/DECODED OUTPUT AND W/DISABLE AND W/ENABLE AND W/STORAGE AND 3-STATE OUTPUT
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE
•
TERMINAL SURFACE TREATMENT: SOLDER
•
MEMORY DEVICE TYPE: PROM
•
MEMORY CAPACITY: UNKNOWN
•
TEST DATA DOCUMENT: 97942-635A327 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING)
•
TIME RATING PER CHACTERISTIC: 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
FEATURES PROVIDEDBIPOLAR AND HERMETICALLY SEALED AND HIGH SPEED AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMED AND W/BUFFERED OUTPUT AND W/DECODED OUTPUT AND W/DISABLE AND W/ENABLE AND W/STORAGE AND 3-STATE OUTPUT
INCLOSURE CONFIGURATIONDUAL-IN-LINE
VOLTAGE RATING AND TYPE PER CHARACTERISTIC-1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE
TERMINAL SURFACE TREATMENTSOLDER
MEMORY DEVICE TYPEPROM
MEMORY CAPACITYUNKNOWN
TEST DATA DOCUMENT97942-635A327 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING)
TIME RATING PER CHACTERISTIC60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
TERMINAL TYPE AND QUANTITY16 PRINTED CIRCUIT
INPUT CIRCUIT PATTERN6 INPUT
VERIFIED SUBSTITUTES & CROSS-REFERENCES 9
635A327H05Interchangeable
interchangeable cross-reference
interchangeable
IM5610MDEInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROM FAMILY 013Interchangeable
interchangeable cross-reference
interchangeable
635A327H01Interchangeable
interchangeable cross-reference
interchangeable
IM5610MJEInterchangeable
interchangeable cross-reference
interchangeable
548088Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 635A327H04?
635A327H04 is a MICROCIRCUIT,MEMORY.
What parts can replace 635A327H04?
There are 9 known substitutes for 635A327H04: 635A327H05, IM5610MDE, ROM/PROM FAMILY 013 and 6 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 635A327H04?
635A327H04 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-047-6648. This indicates validated use in U.S. government and defense supply chains.
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✓ Validated with multiple authoritative sources, including Government, OEM, and Certified sources.
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Last verified: July 2026