The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: PROGRAMMED AND BURN IN, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: PROM, end_item_identification: AN/UYS-1(V), inclosure_configuration: FLAT PACK. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-180-4273, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| features_provided | PROGRAMMED AND BURN IN |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | PROM |
| end_item_identification | AN/UYS-1(V) |
| inclosure_configuration | FLAT PACK |
| NSN | 5962-01-180-4273 |
| MEMORY DEVICE TYPE | PROM |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| END ITEM IDENTIFICATION | AN/UYS-1(V) |
| INCLOSURE MATERIAL | CERAMIC |
| INCLOSURE CONFIGURATION | FLAT PACK |
| FEATURES PROVIDED | PROGRAMMED AND BURN IN |