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Technical Data Sheet
PartsTable / COMPONENT / 6134816-1
6134816-1 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: PROGRAMMABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: PROM, end_item_identification: AN/UYS-1(V), inclosure_configuration: FLAT PACK. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-180-4270, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
6134816-1
NSN: 5962-01-180-4270
FSC: 5962
CAGE: 32293 — INTERSIL INC SUB OF GENERAL ELECTRIC CO (USA)
SPECIFICATIONS
features_providedPROGRAMMABLE
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePROM
end_item_identificationAN/UYS-1(V)
inclosure_configurationFLAT PACK
NSN5962-01-180-4270
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 6134816-1 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INCLOSURE CONFIGURATION: FLAT PACK
•
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
•
FEATURES PROVIDED: PROGRAMMABLE
•
MEMORY DEVICE TYPE: PROM
•
INCLOSURE MATERIAL: CERAMIC
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
INCLOSURE CONFIGURATIONFLAT PACK
OUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC
FEATURES PROVIDEDPROGRAMMABLE
MEMORY DEVICE TYPEPROM
END ITEM IDENTIFICATIONAN/UYS-1(V)
INCLOSURE MATERIALCERAMIC
VERIFIED SUBSTITUTES & CROSS-REFERENCES 10
ROM/PROMInterchangeable
interchangeable cross-reference
interchangeable
6134816-8Interchangeable
interchangeable cross-reference
interchangeable
6088926-3Interchangeable
interchangeable cross-reference
interchangeable
6134816-6Interchangeable
interchangeable cross-reference
interchangeable
6134816-4Interchangeable
interchangeable cross-reference
interchangeable
6086206-2Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 6134816-1?
6134816-1 is a MICROCIRCUIT,MEMORY.
What parts can replace 6134816-1?
There are 10 known substitutes for 6134816-1: ROM/PROM, 6134816-8, 6088926-3 and 7 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 6134816-1?
6134816-1 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-180-4270. This indicates validated use in U.S. government and defense supply chains.
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✓ Validated with multiple authoritative sources, including Government, OEM, and Certified sources.
PartsTable Design LLC · partstable.com
Last verified: July 2026