6121198-3 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

6121198-3: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.285 INCHES MAXIMUM IN, body_height: 0.040 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN, body_length: 0.440 INCHES MAXIMUM IN, overall_width: 0.750 INCHES MINIMUM IN, features_provided: HIGH SPEED AND PROGRAMMABLE AND BIPOLAR AND W/ENABLE AND W/ACTIVE PULL-UP, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-283-8003, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

6121198-3

NSN: 5962-01-283-8003
FSC: 5962 — Microcircuits, Electronic
CAGE: 03640 — LOCKHEED MARTIN CORPORATION DIV ROTARY AND MISSION SYSTEMS (USA)

SPECIFICATIONS

body_width	0.285 INCHES MAXIMUM IN
body_height	0.040 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN
body_length	0.440 INCHES MAXIMUM IN
overall_width	0.750 INCHES MINIMUM IN
features_provided	HIGH SPEED AND PROGRAMMABLE AND BIPOLAR AND W/ENABLE AND W/ACTIVE PULL-UP
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
inclosure_configuration	FLAT PACK
NSN	5962-01-283-8003

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 10 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.285 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.040 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HIGH SPEED AND PROGRAMMABLE AND BIPOLAR AND W/ENABLE AND W/ACTIVE PULL-UP

•

INCLOSURE CONFIGURATION: FLAT PACK

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	10 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.285 INCHES MAXIMUM IN
BODY HEIGHT	0.040 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN
OVERALL WIDTH	0.750 INCHES MINIMUM IN
FEATURES PROVIDED	HIGH SPEED AND PROGRAMMABLE AND BIPOLAR AND W/ENABLE AND W/ACTIVE PULL-UP
INCLOSURE CONFIGURATION	FLAT PACK
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.440 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROM FAMILY 015Reference document

Same NSN cross-reference

Reference document — Secondary reference

IM5623MFEReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 6121198-3?

6121198-3 is a MICROCIRCUIT,MEMORY.

What parts can replace 6121198-3?

There are 2 known substitutes for 6121198-3: ROM/PROM FAMILY 015, IM5623MFE. Substitute compatibility should be verified for your specific system.

What is the NSN for 6121198-3?

6121198-3 is cataloged in the U.S. Government catalog under NSN 5962-01-283-8003. This indicates validated use in U.S. government and defense supply chains.

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6121198-3 — MICROCIRCUIT,MEMORY

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