IM5623MFE: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN, body_height: 0.040 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN, body_length: 0.440 INCHES MAXIMUM IN, overall_width: 0.750 INCHES MINIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND HIGH SPEED AND PROGRAMMABLE AND BIPOLAR, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-283-8003, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.245 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN |
| body_height | 0.040 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN |
| body_length | 0.440 INCHES MAXIMUM IN |
| overall_width | 0.750 INCHES MINIMUM IN |
| features_provided | HERMETICALLY SEALED AND BURN IN AND HIGH SPEED AND PROGRAMMABLE AND BIPOLAR |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | ROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 10 INPUT |
| inclosure_configuration | FLAT PACK |
| NSN | 5962-01-283-8003 |
| INPUT CIRCUIT PATTERN | 10 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.285 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.040 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN |
| OVERALL WIDTH | 0.750 INCHES MINIMUM IN |
| FEATURES PROVIDED | HIGH SPEED AND PROGRAMMABLE AND BIPOLAR AND W/ENABLE AND W/ACTIVE PULL-UP |
| INCLOSURE CONFIGURATION | FLAT PACK |
| MEMORY DEVICE TYPE | ROM |
| BODY LENGTH | 0.440 INCHES MAXIMUM IN |