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Technical Data Sheet
PartsTable / COMPONENT / 5962-8680405LA
5962-8680405LA ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.280 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMABLE AND MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-294-0105, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
5962-8680405LA
NSN: 5962-01-294-0105
FSC: 5962
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.185 INCHES MAXIMUM IN
body_length1.280 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMABLE AND MONOLITHIC
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePAL
storage_temp_range-60.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern20 INPUT
end_item_identification5811-01-164-9983
NSN5962-01-294-0105
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 5962-8680405LA MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMABLE AND MONOLITHIC
•
BODY LENGTH: 1.280 INCHES MAXIMUM IN
•
STORAGE TEMP RANGE: -60.0 TO 150.0 CELSIUS DEGC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
MAXIMUM POWER DISSIPATION RATING: 1.2 WATTS
•
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
•
BODY HEIGHT: 0.185 INCHES MAXIMUM IN
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMABLE AND MONOLITHIC
BODY LENGTH1.280 INCHES MAXIMUM IN
STORAGE TEMP RANGE-60.0 TO 150.0 CELSIUS DEGC
TERMINAL SURFACE TREATMENTSOLDER
MAXIMUM POWER DISSIPATION RATING1.2 WATTS
END ITEM IDENTIFICATION5811-01-164-9983
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
BODY HEIGHT0.185 INCHES MAXIMUM IN
BODY WIDTH0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN20 INPUT
VERIFIED SUBSTITUTES & CROSS-REFERENCES 17
5962-8680401LXInterchangeable
interchangeable cross-reference
interchangeable
PAL18L4MJS/883BInterchangeable
interchangeable cross-reference
interchangeable
5962-8680401LAInterchangeable
interchangeable cross-reference
interchangeable
PAL12L10MJS/883BInterchangeable
interchangeable cross-reference
interchangeable
5962-86804Interchangeable
interchangeable cross-reference
interchangeable
5962-8680402LAInterchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 5962-8680405LA?
5962-8680405LA is a MICROCIRCUIT,MEMORY.
What parts can replace 5962-8680405LA?
There are 17 known substitutes for 5962-8680405LA: 5962-8680401LX, PAL18L4MJS/883B, 5962-8680401LA and 14 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 5962-8680405LA?
5962-8680405LA is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-294-0105. This indicates validated use in U.S. government and defense supply chains.
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Last verified: July 2026