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Technical Data Sheet
PartsTable / COMPONENT / 5962-8680401LA
5962-8680401LA ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 1.280 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-295-4578, indicating validated use in U.S.

government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
5962-8680401LA
NSN: 5962-01-295-4578
FSC: 5962
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length1.280 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND MONOLITHIC
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePAL
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern18 INPUT
inclosure_configurationDUAL-IN-LINE
NSN5962-01-295-4578
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 5962-8680401LA MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INCLOSURE MATERIAL: CERAMIC
•
TIME RATING PER CHACTERISTIC: 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND MONOLITHIC
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
•
MEMORY DEVICE TYPE: PAL
•
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
•
MAXIMUM POWER DISSIPATION RATING: 1.2 WATTS
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
INCLOSURE MATERIALCERAMIC
TIME RATING PER CHACTERISTIC45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND MONOLITHIC
INCLOSURE CONFIGURATIONDUAL-IN-LINE
BODY WIDTH0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
MEMORY DEVICE TYPEPAL
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
MAXIMUM POWER DISSIPATION RATING1.2 WATTS
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
INPUT CIRCUIT PATTERN18 INPUT
VERIFIED SUBSTITUTES & CROSS-REFERENCES 16
5962-8680405LXInterchangeable
interchangeable cross-reference
interchangeable
PAL20L2MJS/883BInterchangeable
interchangeable cross-reference
interchangeable
PAL20L2MJ/883BInterchangeable
interchangeable cross-reference
interchangeable
PAL12L10MJS/883BInterchangeable
interchangeable cross-reference
interchangeable
5962-86804Interchangeable
interchangeable cross-reference
interchangeable
5962-8680402LAInterchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusCANCELLED
Availability—
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 5962-8680401LA?
5962-8680401LA is a MICROCIRCUIT,MEMORY.
What parts can replace 5962-8680401LA?
There are 16 known substitutes for 5962-8680401LA: 5962-8680405LX, PAL20L2MJS/883B, PAL20L2MJ/883B and 13 more. Substitute compatibility should be verified for your specific system.
Is 5962-8680401LA still available?
5962-8680401LA is currently cancelled.
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Last verified: July 2026