5962-38267: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.458 INCHES MAXIMUM IN, body_height: 0.120 INCHES MAXIMUM IN, body_length: 0.560 INCHES MAXIMUM IN, memory_capacity: 128K X 8, features_provided: ELECTROSTATIC SENSITIVE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-370-0998, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.458 INCHES MAXIMUM IN |
| body_height | 0.120 INCHES MAXIMUM IN |
| body_length | 0.560 INCHES MAXIMUM IN |
| bit_quantity | 1 |
| memory_capacity | 128K X 8 |
| features_provided | ELECTROSTATIC SENSITIVE |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | EEPROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| NSN | 5962-01-370-0998 |
| HYBRID TECHNOLOGY TYPE | MONOLITHIC |
| INPUT CIRCUIT PATTERN | 27 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.430 INCHES MINIMUM AND 0.488 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.090 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN |
| FEATURES PROVIDED | BURN IN AND HERMETICALLY SEALED AND BIDIRECTIONAL AND ERASABLE AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE AND MONOLITHIC |
| INCLOSURE CONFIGURATION | FLAT PACK |
| CURRENT RATING PER CHARACTERISTIC | 80.00 MILLIAMPERES NOMINAL TOTAL SUPPLY |
| MEMORY DEVICE TYPE | EEPROM |