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10133974 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

10133974: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.430 INCHES MINIMUM AND 0.488 INCHES MAXIMUM IN, body_height: 0.090 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN, body_length: 0.830 INCHES MAXIMUM IN, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: EEPROM. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-370-0998, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
10133974
NSN: 5962-01-370-0998
FSC: 5962 — Microcircuits, Electronic
CAGE: A486G — NIMIKKEISTOKESKUS NCB FINLAND (FIN)
SPECIFICATIONS
body_width0.430 INCHES MINIMUM AND 0.488 INCHES MAXIMUM IN
body_height0.090 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
body_length0.830 INCHES MAXIMUM IN
features_providedBURN IN AND HERMETICALLY SEALED AND BIDIRECTIONAL AND ERASABLE AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE AND MONOLITHIC
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeEEPROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern27 INPUT
hybrid_technology_typeMONOLITHIC
NSN5962-01-370-0998
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 10133974 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
HYBRID TECHNOLOGY TYPE: MONOLITHIC
•
INPUT CIRCUIT PATTERN: 27 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.430 INCHES MINIMUM AND 0.488 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.090 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
•
FEATURES PROVIDED: BURN IN AND HERMETICALLY SEALED AND BIDIRECTIONAL AND ERASABLE AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE AND MONOLITHIC
•
INCLOSURE CONFIGURATION: FLAT PACK
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
HYBRID TECHNOLOGY TYPEMONOLITHIC
INPUT CIRCUIT PATTERN27 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.430 INCHES MINIMUM AND 0.488 INCHES MAXIMUM IN
BODY HEIGHT0.090 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
FEATURES PROVIDEDBURN IN AND HERMETICALLY SEALED AND BIDIRECTIONAL AND ERASABLE AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE AND MONOLITHIC
INCLOSURE CONFIGURATIONFLAT PACK
CURRENT RATING PER CHARACTERISTIC80.00 MILLIAMPERES NOMINAL TOTAL SUPPLY
MEMORY DEVICE TYPEEEPROM
SUBSTITUTES & CROSS-REFERENCES 7
X28C010FMB-25Reference document
Same NSN cross-reference
Reference document — Secondary reference
AT28C010-25FM/883XReference document
Same NSN cross-reference
Reference document — Secondary reference
FM28C010-250Reference document
Same NSN cross-reference
Reference document — Secondary reference
5962-3826701MZASame NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
5962-3826701MZBReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-3826701MZXReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is 10133974?
10133974 is a MICROCIRCUIT,MEMORY.
What parts can replace 10133974?
There are 7 known substitutes for 10133974: X28C010FMB-25, AT28C010-25FM/883X, FM28C010-250 and 4 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 10133974?
10133974 is cataloged in the U.S. Government catalog under NSN 5962-01-370-0998. This indicates validated use in U.S. government and defense supply chains.
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✓ PartsTable — the parts reference. Every fact cited to its source.
PartsTable Design LLC · partstable.com
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-18.
PartsTable commercial catalog: edition Unified commercial catalog snapshot through 2026-09-28, edition date not on file, retrieved 2026-09-28.