The Microcircuit,memory, cataloged under National Stock Number 5962-01-339-6331, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is L3harris Technologies, Inc.. Government technical data includes 17 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 8 commercial cross-references from 4 manufacturers, enabling identification through both NSN and commercial part number lookups. 12 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-339-6331 |
| Primary Part Number | 106462-25 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | L3harris Technologies, Inc. |
| Status | ACTIVE |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Inclosure Material | CERAMIC |
| Time Rating Per Chacteristic | 100.00 NANOSECONDS MAXIMUM ACCESS NS |
| Terminal Surface Treatment | SOLDER |
| Terminal Type and Quantity | 24 PRINTED CIRCUIT |
| Case Outline Source and Designator | D-3 MIL-M-38510 |
| Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| Voltage Rating and Type Per Characteristic | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| Memory Device Type | PROM |
| Inclosure Configuration | DUAL-IN-LINE |
| Body Width | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN |
| Input Circuit Pattern | 14 INPUT |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Features Provided | BURN IN AND ELECTROSTATIC SENSITIVE AND BIPOLAR AND PROGRAMMED AND SCHOTTKY |
| Body Length | 1.290 INCHES MAXIMUM IN |
| Body Height | 0.210 INCHES MAXIMUM IN |
| Maximum Power Dissipation Rating | 1.02 WATTS |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| 114838-1 | L3harris Technologies, Inc. Div Space and Airborne Systems (USA) |
| ROM/PROM FAMILY 029 | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| M38510/21002BJA | Military Specifications Promulgated by Military Departments/agencies Under Authority of Defense Standardization Manual 4120 3-M |
| 5962-3821002BJA | Military Specifications Promulgated by Military Departments/agencies Under Authority of Defense Standardization Manual 4120 3-M |
| 0102239-1 | L3harris Technologies, Inc. Div Space and Airborne Systems (USA) |
| 114838-1 | L3harris Technologies, Inc. (USA) |
| 106462-25 | L3harris Technologies, Inc. Div Space and Airborne Systems (USA) |
| 106462-25 PRIMARY | L3harris Technologies, Inc. (USA) |
NSN 5962-01-339-6331 is a Microcircuit,memory, manufactured by L3harris Technologies, Inc., classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-339-6331 has 8 cross-referenced part numbers: 114838-1 (L3harris Technologies, Inc. Div Space and Airborne Systems), ROM/PROM FAMILY 029 (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)), M38510/21002BJA (Military Specifications Promulgated by Military Departments/agencies Under Authority of Defense Standardization Manual 4120 3-M), 5962-3821002BJA (Military Specifications Promulgated by Military Departments/agencies Under Authority of Defense Standardization Manual 4120 3-M), 0102239-1 (L3harris Technologies, Inc. Div Space and Airborne Systems) and 3 more.
There are 12 known substitutes for 5962-01-339-6331: 5962-01-093-6160, 5962-01-132-7844, 5962-01-242-6939 and 9 more. Verify interchangeability with system specifications before substitution.
Key specifications for 106462-25: Operating Temp Range: -55.0 TO 125.0 CELSIUS DEGC; Inclosure Material: CERAMIC; Time Rating Per Chacteristic: 100.00 NANOSECONDS MAXIMUM ACCESS NS; Terminal Surface Treatment: SOLDER. 17 total characteristics are documented in the Federal Logistics Information System.