The Microcircuit,memory, cataloged under National Stock Number 5962-01-330-5519, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Advanced Micro Devices Inc Dba AMD Austin. Government technical data includes 17 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 3 commercial cross-references from 3 manufacturers, enabling identification through both NSN and commercial part number lookups. 1 verified substitute exists in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-330-5519 |
| Primary Part Number | AM27S03A/B2A |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Advanced Micro Devices Inc Dba AMD Austin |
| Status | ACTIVE |
| Body Height | 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN |
| Inclosure Configuration | LEADLESS FLAT PACK |
| Memory Device Type | RAM |
| Case Outline Source and Designator | C-2 MIL-M-38510 |
| Terminal Surface Treatment | SOLDER |
| Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| Time Rating Per Chacteristic | 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| Voltage Rating and Type Per Characteristic | -0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| Terminal Type and Quantity | 20 LEADLESS |
| Input Circuit Pattern | 10 INPUT |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Body Length | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN |
| Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Body Width | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN |
| Features Provided | HERMETICALLY SEALED AND BURN IN AND W/DECODED OUTPUT AND HIGH SPEED |
| Inclosure Material | CERAMIC |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| AM27S03A/B2A PRIMARY | Advanced Micro Devices Inc Dba AMD Austin (USA) |
| CY27S03ALMB | Infineon Technologies Americas Corp. (USA) |
| 7544187P501 | Lockheed Martin Corp Naval Electronics & Surveillance Systems (USA) |
NSN 5962-01-330-5519 is a Microcircuit,memory, manufactured by Advanced Micro Devices Inc Dba AMD Austin, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-330-5519 has 3 cross-referenced part numbers: AM27S03A/B2A (Advanced Micro Devices Inc Dba AMD Austin), CY27S03ALMB (Infineon Technologies Americas Corp.), 7544187P501 (Lockheed Martin Corp Naval Electronics & Surveillance Systems).
There is 1 known substitute for 5962-01-330-5519: 5962-01-330-0702. Verify interchangeability with system specifications before substitution.
Key specifications for AM27S03A/B2A: Body Height: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN; Inclosure Configuration: LEADLESS FLAT PACK; Memory Device Type: RAM; Case Outline Source and Designator: C-2 MIL-M-38510. 17 total characteristics are documented in the Federal Logistics Information System.