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Technical Data Sheet
7544187P501 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, body_height: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, body_length: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND W/DECODED OUTPUT AND HIGH SPEED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-330-5519, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
7544187P501
NSN: 5962-01-330-5519
FSC: 5962
CAGE: 99971 — LOCKHEED MARTIN CORP NAVAL ELECTRONICS & SURVEILLANCE SYSTEMS (USA)
SPECIFICATIONS
body_width0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
body_height0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
body_length0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND BURN IN AND W/DECODED OUTPUT AND HIGH SPEED
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeRAM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern10 INPUT
inclosure_configurationLEADLESS FLAT PACK
NSN5962-01-330-5519
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 7544187P501 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
MEMORY DEVICE TYPE: RAM
CASE OUTLINE SOURCE AND DESIGNATOR: C-2 MIL-M-38510
TERMINAL SURFACE TREATMENT: SOLDER
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
TIME RATING PER CHACTERISTIC: 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
BODY HEIGHT0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
INCLOSURE CONFIGURATIONLEADLESS FLAT PACK
MEMORY DEVICE TYPERAM
CASE OUTLINE SOURCE AND DESIGNATORC-2 MIL-M-38510
TERMINAL SURFACE TREATMENTSOLDER
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
TIME RATING PER CHACTERISTIC35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC-0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
TERMINAL TYPE AND QUANTITY20 LEADLESS
INPUT CIRCUIT PATTERN10 INPUT
VERIFIED SUBSTITUTES & CROSS-REFERENCES 4
86051052AInterchangeable
interchangeable cross-reference
interchangeable
86051052BInterchangeable
interchangeable cross-reference
interchangeable
86051052XInterchangeable
interchangeable cross-reference
interchangeable
CY27S03ALMBInterchangeable
Same NIIN cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 7544187P501?
7544187P501 is a MICROCIRCUIT,MEMORY.
What parts can replace 7544187P501?
There are 4 known substitutes for 7544187P501: 86051052A, 86051052B, 86051052X and 1 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 7544187P501?
7544187P501 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-330-5519. This indicates validated use in U.S. government and defense supply chains.
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