The Microcircuit,memory, cataloged under National Stock Number 5962-01-328-5617, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Honeywell International Inc. Dba Honeywell International Div Aerospace-Minneapolis. Government technical data includes 19 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 4 commercial cross-references from 3 manufacturers, enabling identification through both NSN and commercial part number lookups. 3 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-328-5617 |
| Primary Part Number | 10122829-109 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Honeywell International Inc. Dba Honeywell International Div Aerospace-Minneapolis |
| Status | ACTIVE |
| Body Width | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN |
| Inclosure Material | CERAMIC |
| Input Circuit Pattern | 17 INPUT |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Memory Capacity | UNKNOWN |
| Time Rating Per Chacteristic | 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| Terminal Type and Quantity | 28 PRINTED CIRCUIT |
| Voltage Rating and Type Per Characteristic | -0.6 VOLTS MINIMUM POWER SOURCE AND 6.5 VOLTS MAXIMUM POWER SOURCE |
| Memory Device Type | ROM |
| Case Outline Source and Designator | D-10 MIL-M-38510 |
| Terminal Surface Treatment | SOLDER |
| Output Logic Form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| Inclosure Configuration | DUAL-IN-LINE |
| Features Provided | BURN IN AND HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMED |
| Body Height | 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN |
| Maximum Power Dissipation Rating | 1.0 WATTS |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Body Length | 1.490 INCHES MAXIMUM IN |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| 10122829-109 | Honeywell International Inc. Dba Honeywell International Div Aerospace-Minneapolis (USA) |
| 8411103YA | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (standard Microcircuit (USA) |
| 5962-8411103BYA | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (standard Microcircuit (USA) |
| ROM/PROM | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
NSN 5962-01-328-5617 is a Microcircuit,memory, manufactured by Honeywell International Inc. Dba Honeywell International Div Aerospace-Minneapolis, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-328-5617 has 4 cross-referenced part numbers: 10122829-109 (Honeywell International Inc. Dba Honeywell International Div Aerospace-Minneapolis), 8411103YA (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (standard Microcircuit), 5962-8411103BYA (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (standard Microcircuit), ROM/PROM (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)).
There are 3 known substitutes for 5962-01-328-5617: 5962-01-201-1414, 5962-01-328-4665, 5962-01-380-7770. Verify interchangeability with system specifications before substitution.
Key specifications for 10122829-109: Body Width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN; Inclosure Material: CERAMIC; Input Circuit Pattern: 17 INPUT; Storage Temp Range: -65.0 TO 150.0 CELSIUS DEGC. 19 total characteristics are documented in the Federal Logistics Information System.