Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: 10122829-109

10122829-109 ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN, body_length: 1.490 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: BURN IN AND HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMED, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-328-5617, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

10122829-109

NSN: 5962-01-328-5617
FSC: 5962
CAGE: 94580 — HONEYWELL INTERNATIONAL INC. DBA HONEYWELL INTERNATIONAL DIV AEROSPACE-MINNEAPOLIS (USA)

SPECIFICATIONS

body_width	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height	0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN
body_length	1.490 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	BURN IN AND HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMED
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	17 INPUT
NSN	5962-01-328-5617

COMPONENT DIAGRAM

KEY FEATURES

•

BODY WIDTH: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN

•

INCLOSURE MATERIAL: CERAMIC

•

INPUT CIRCUIT PATTERN: 17 INPUT

•

STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

•

MEMORY CAPACITY: UNKNOWN

•

TIME RATING PER CHACTERISTIC: 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS

•

TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

•

TERMINAL TYPE AND QUANTITY: 28 PRINTED CIRCUIT

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

BODY WIDTH	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
INCLOSURE MATERIAL	CERAMIC
INPUT CIRCUIT PATTERN	17 INPUT
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
MEMORY CAPACITY	UNKNOWN
TIME RATING PER CHACTERISTIC	200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
TERMINAL TYPE AND QUANTITY	28 PRINTED CIRCUIT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	-0.6 VOLTS MINIMUM POWER SOURCE AND 6.5 VOLTS MAXIMUM POWER SOURCE
MEMORY DEVICE TYPE	ROM

VERIFIED SUBSTITUTES & CROSS-REFERENCES 10

AM27256-20DMBInterchangeable