The Microcircuit,memory, cataloged under National Stock Number 5962-01-308-5518, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Lockheed Martin Corporation Div Rotary and Mission Systems. Government technical data includes 19 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 3 commercial cross-references from 3 manufacturers, enabling identification through both NSN and commercial part number lookups. 12 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-308-5518 |
| Primary Part Number | 63A141536P6 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Lockheed Martin Corporation Div Rotary and Mission Systems |
| Status | ACTIVE |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Voltage Rating and Type Per Characteristic | -0.3 VOLTS MAXIMUM POWER SOURCE AND 6.0 VOLTS MAXIMUM POWER SOURCE |
| Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| Terminal Surface Treatment | SOLDER |
| Case Outline Source and Designator | D-3 MIL-M-38510 |
| Memory Capacity | UNKNOWN |
| Terminal Type and Quantity | 24 PRINTED CIRCUIT |
| Time Rating Per Chacteristic | 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| Memory Device Type | ROM |
| Inclosure Material | CERAMIC |
| Features Provided | HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND W/ENABLE |
| Output Logic Form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| Inclosure Configuration | DUAL-IN-LINE |
| Body Height | 0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN |
| Maximum Power Dissipation Rating | 635.0 MILLIWATTS |
| Body Width | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN |
| Body Length | 1.290 INCHES MAXIMUM IN |
| Input Circuit Pattern | 13 INPUT |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| 63A141536P6 PRIMARY | Lockheed Martin Corporation Div Rotary and Mission Systems (USA) |
| ROM/PROM FAMILY 020 | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| 7802201JA | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (standard Microcircuit (USA) |
NSN 5962-01-308-5518 is a Microcircuit,memory, manufactured by Lockheed Martin Corporation Div Rotary and Mission Systems, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-308-5518 has 3 cross-referenced part numbers: 63A141536P6 (Lockheed Martin Corporation Div Rotary and Mission Systems), ROM/PROM FAMILY 020 (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)), 7802201JA (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (standard Microcircuit).
There are 12 known substitutes for 5962-01-308-5518: 5962-01-107-1082, 5962-01-176-1233, 5962-01-207-7146 and 9 more. Verify interchangeability with system specifications before substitution.
Key specifications for 63A141536P6: Operating Temp Range: -55.0 TO 125.0 CELSIUS DEGC; Voltage Rating and Type Per Characteristic: -0.3 VOLTS MAXIMUM POWER SOURCE AND 6.0 VOLTS MAXIMUM POWER SOURCE; Test Data Document: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).; Terminal Surface Treatment: SOLDER. 20 total characteristics are documented in the Federal Logistics Information System.