The Microcircuit,memory, cataloged under National Stock Number 5962-01-308-3565, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Lockheed Martin Corporation Div Rotary and Mission Systems. Government technical data includes 18 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 3 commercial cross-references from 3 manufacturers, enabling identification through both NSN and commercial part number lookups. 12 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-308-3565 |
| Primary Part Number | 63A141536P2 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Lockheed Martin Corporation Div Rotary and Mission Systems |
| Status | ACTIVE |
| Output Logic Form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| Body Length | 1.290 INCHES MAXIMUM IN |
| Terminal Type and Quantity | 24 PRINTED CIRCUIT |
| Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| Terminal Surface Treatment | SOLDER |
| Time Rating Per Chacteristic | 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| Case Outline Source and Designator | D-3 MIL-M-38510 |
| Voltage Rating and Type Per Characteristic | -0.3 VOLTS MINIMUM POWER SOURCE AND 6.0 VOLTS MAXIMUM POWER SOURCE |
| Memory Device Type | ROM |
| Inclosure Material | CERAMIC |
| Body Height | 0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Body Width | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN |
| Input Circuit Pattern | 13 INPUT |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Inclosure Configuration | DUAL-IN-LINE |
| Maximum Power Dissipation Rating | 635.0 MILLIWATTS |
| Features Provided | HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND W/ENABLE |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| ROM/PROM FAMILY 020 | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| 63A141536P2 PRIMARY | Lockheed Martin Corporation Div Rotary and Mission Systems (USA) |
| 7802201JA | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (standard Microcircuit (USA) |
NSN 5962-01-308-3565 is a Microcircuit,memory, manufactured by Lockheed Martin Corporation Div Rotary and Mission Systems, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-308-3565 has 3 cross-referenced part numbers: ROM/PROM FAMILY 020 (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)), 63A141536P2 (Lockheed Martin Corporation Div Rotary and Mission Systems), 7802201JA (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (standard Microcircuit).
There are 12 known substitutes for 5962-01-308-3565: 5962-01-107-1082, 5962-01-176-1233, 5962-01-207-7146 and 9 more. Verify interchangeability with system specifications before substitution.
Key specifications for 63A141536P2: Output Logic Form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC; Body Length: 1.290 INCHES MAXIMUM IN; Terminal Type and Quantity: 24 PRINTED CIRCUIT; Test Data Document: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).. 19 total characteristics are documented in the Federal Logistics Information System.