The Microcircuit,memory, cataloged under National Stock Number 5962-01-264-5234, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Philips Semiconductors Inc. Government technical data includes 18 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 7 commercial cross-references from 4 manufacturers, enabling identification through both NSN and commercial part number lookups. 12 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-264-5234 |
| Primary Part Number | 82H641A/B3X |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Philips Semiconductors Inc |
| Status | ACTIVE |
| Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
| Inclosure Configuration | LEADLESS FLAT PACK |
| Maximum Power Dissipation Rating | 1.04 WATTS |
| Body Height | 0.100 INCHES MAXIMUM IN |
| Input Circuit Pattern | 14 INPUT |
| Terminal Type and Quantity | 28 LEADLESS |
| Terminal Surface Treatment | SOLDER |
| Case Outline Source and Designator | C-4 MIL-M-38510 |
| Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| Voltage Rating and Type Per Characteristic | -0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| Time Rating Per Chacteristic | 55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| Memory Device Type | ROM |
| Inclosure Material | CERAMIC AND GLASS |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Features Provided | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND 3-STATE OUTPUT AND MONOLITHIC |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Body Width | 0.358 INCHES MAXIMUM IN |
| Body Length | 0.358 INCHES MAXIMUM IN |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| 82H641A/B3X | Philips Semiconductors Inc (USA) |
| 82009 | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (standard Microcircuit (USA) |
| 82009023B | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (standard Microcircuit (USA) |
| ROM/PROM | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| 82009023A | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (standard Microcircuit (USA) |
| 82009023X | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (standard Microcircuit (USA) |
| AM27S49A/B3A | Advanced Micro Devices Inc Dba AMD Austin (USA) |
NSN 5962-01-264-5234 is a Microcircuit,memory, manufactured by Philips Semiconductors Inc, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-264-5234 has 7 cross-referenced part numbers: 82H641A/B3X (Philips Semiconductors Inc), 82009 (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (standard Microcircuit), 82009023B (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (standard Microcircuit), ROM/PROM (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)), 82009023A (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (standard Microcircuit) and 2 more.
There are 12 known substitutes for 5962-01-264-5234: 5950-00-015-7281, 6625-00-242-8590, 2990-00-706-6528 and 9 more. Verify interchangeability with system specifications before substitution.
Key specifications for 82H641A/B3X: Output Logic Form: TRANSISTOR-TRANSISTOR LOGIC; Inclosure Configuration: LEADLESS FLAT PACK; Maximum Power Dissipation Rating: 1.04 WATTS; Body Height: 0.100 INCHES MAXIMUM IN. 18 total characteristics are documented in the Federal Logistics Information System.