PartsTable
Technical Data Sheet
PartsTable / COMPONENT / 82009023B
82009023B ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.358 INCHES MAXIMUM IN, body_height: 0.100 INCHES MAXIMUM IN, body_length: 0.358 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND 3-STATE OUTPUT AND MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-264-5234, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
82009023B
NSN: 5962-01-264-5234
FSC: 5962
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)
SPECIFICATIONS
body_width0.358 INCHES MAXIMUM IN
body_height0.100 INCHES MAXIMUM IN
body_length0.358 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND 3-STATE OUTPUT AND MONOLITHIC
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC AND GLASS
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern14 INPUT
inclosure_configurationLEADLESS FLAT PACK
NSN5962-01-264-5234
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 82009023B MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
•
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
•
MAXIMUM POWER DISSIPATION RATING: 1.04 WATTS
•
BODY HEIGHT: 0.100 INCHES MAXIMUM IN
•
INPUT CIRCUIT PATTERN: 14 INPUT
•
TERMINAL TYPE AND QUANTITY: 28 LEADLESS
•
TERMINAL SURFACE TREATMENT: SOLDER
•
CASE OUTLINE SOURCE AND DESIGNATOR: C-4 MIL-M-38510
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
OUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC
INCLOSURE CONFIGURATIONLEADLESS FLAT PACK
MAXIMUM POWER DISSIPATION RATING1.04 WATTS
BODY HEIGHT0.100 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN14 INPUT
TERMINAL TYPE AND QUANTITY28 LEADLESS
TERMINAL SURFACE TREATMENTSOLDER
CASE OUTLINE SOURCE AND DESIGNATORC-4 MIL-M-38510
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
VOLTAGE RATING AND TYPE PER CHARACTERISTIC-0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
VERIFIED SUBSTITUTES & CROSS-REFERENCES 24
82009Interchangeable
interchangeable cross-reference
interchangeable
99254574Interchangeable
interchangeable cross-reference
interchangeable
2500HInterchangeable
interchangeable cross-reference
interchangeable
B6038CInterchangeable
interchangeable cross-reference
interchangeable
3-5020452AC5AXA 8957431-2009Interchangeable
interchangeable cross-reference
interchangeable
51T6038AInterchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 82009023B?
82009023B is a MICROCIRCUIT,MEMORY.
What parts can replace 82009023B?
There are 24 known substitutes for 82009023B: 82009, 99254574, 2500H and 21 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 82009023B?
82009023B is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-264-5234. This indicates validated use in U.S. government and defense supply chains.
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Last verified: July 2026