The Microcircuit,memory, cataloged under National Stock Number 5962-01-185-5432, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Northrop Grumman Systems Corp Dba Northrop Grumman Systems Corp. Government technical data includes 18 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 5 commercial cross-references from 4 manufacturers, enabling identification through both NSN and commercial part number lookups. 12 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-185-5432 |
| Primary Part Number | 900146-032 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Northrop Grumman Systems Corp Dba Northrop Grumman Systems Corp |
| Status | ACTIVE |
| Inclosure Configuration | DUAL-IN-LINE |
| Inclosure Material | CERAMIC AND GLASS |
| Terminal Type and Quantity | 16 PRINTED CIRCUIT |
| Time Rating Per Chacteristic | 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| Memory Device Type | PROM |
| Voltage Rating and Type Per Characteristic | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| Memory Capacity | UNKNOWN |
| Case Outline Source and Designator | D-2 MIL-M-38510 |
| Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| Terminal Surface Treatment | SOLDER |
| Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Features Provided | HERMETICALLY SEALED AND MONOLITHIC AND 3-STATE OUTPUT AND PROGRAMMABLE |
| Body Height | 0.185 INCHES NOMINAL IN |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Input Circuit Pattern | 10 INPUT |
| Body Length | 0.840 INCHES MAXIMUM IN |
| Body Width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| 93446DMQB | Fairchild Semiconductor Corp (USA) |
| 900146-032 PRIMARY | Northrop Grumman Systems Corp Dba Northrop Grumman Systems Corp (USA) |
| 900146-2 | Northrop Grumman Systems Corp Dba Northrop Grumman Systems Corp (USA) |
| M38510/20402BEA | Military Specifications Promulgated by Military Departments/agencies Under Authority of Defense Standardization Manual 4120 3-M |
| ROM/PROM FAMILY 008 | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
NSN 5962-01-185-5432 is a Microcircuit,memory, manufactured by Northrop Grumman Systems Corp Dba Northrop Grumman Systems Corp, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-185-5432 has 5 cross-referenced part numbers: 93446DMQB (Fairchild Semiconductor Corp), 900146-032 (Northrop Grumman Systems Corp Dba Northrop Grumman Systems Corp), 900146-2 (Northrop Grumman Systems Corp Dba Northrop Grumman Systems Corp), M38510/20402BEA (Military Specifications Promulgated by Military Departments/agencies Under Authority of Defense Standardization Manual 4120 3-M), ROM/PROM FAMILY 008 (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)).
There are 12 known substitutes for 5962-01-185-5432: 5962-01-043-7919, 5962-01-085-4444, 5962-01-101-2202 and 9 more. Verify interchangeability with system specifications before substitution.
Key specifications for 900146-032: Inclosure Configuration: DUAL-IN-LINE; Inclosure Material: CERAMIC AND GLASS; Terminal Type and Quantity: 16 PRINTED CIRCUIT; Time Rating Per Chacteristic: 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS. 18 total characteristics are documented in the Federal Logistics Information System.