The Microcircuit,memory, cataloged under National Stock Number 5962-01-182-6520, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is The Boeing Company Div Defense. Government technical data includes 17 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 5 commercial cross-references from 5 manufacturers, enabling identification through both NSN and commercial part number lookups. 10 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-182-6520 |
| Primary Part Number | 220-11800-105 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | The Boeing Company Div Defense |
| Status | ACTIVE |
| Input Circuit Pattern | 10 INPUT |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| Time Rating Per Chacteristic | 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| Memory Device Type | ROM |
| Terminal Type and Quantity | 20 PRINTED CIRCUIT |
| Voltage Rating and Type Per Characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
| Memory Capacity | UNKNOWN |
| Terminal Surface Treatment | SOLDER |
| Body Height | 0.215 INCHES MAXIMUM IN |
| Inclosure Configuration | DUAL-IN-LINE |
| Inclosure Material | CERAMIC |
| Features Provided | HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND W/ENABLE AND 3-STATE OUTPUT |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Body Length | 0.985 INCHES MAXIMUM IN |
| Body Width | 0.280 INCHES MAXIMUM IN |
| Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| ROM/PROM FAMILY 016 | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| DM54S472J883B | National Semiconductor Corporation (USA) |
| AM27S29DMB | Advanced Micro Devices Inc Dba AMD Austin (USA) |
| SNC54S472 | Texas Instruments Incorporated (USA) |
| 220-11800-105 PRIMARY | The Boeing Company Div Defense (USA) |
NSN 5962-01-182-6520 is a Microcircuit,memory, manufactured by The Boeing Company Div Defense, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-182-6520 has 5 cross-referenced part numbers: ROM/PROM FAMILY 016 (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)), DM54S472J883B (National Semiconductor Corporation), AM27S29DMB (Advanced Micro Devices Inc Dba AMD Austin), SNC54S472 (Texas Instruments Incorporated), 220-11800-105 (The Boeing Company Div Defense).
There are 10 known substitutes for 5962-01-182-6520: 5962-01-084-0312, 5962-01-143-5793, 5962-01-143-5794 and 7 more. Verify interchangeability with system specifications before substitution.
Key specifications for 220-11800-105: Input Circuit Pattern: 10 INPUT; Storage Temp Range: -65.0 TO 150.0 CELSIUS DEGC; Test Data Document: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).; Time Rating Per Chacteristic: 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS. 17 total characteristics are documented in the Federal Logistics Information System.