The Microcircuit,memory, cataloged under National Stock Number 5962-01-143-5797, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Lockheed Martin Corporation. Government technical data includes 18 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 4 commercial cross-references from 3 manufacturers, enabling identification through both NSN and commercial part number lookups. 12 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-143-5797 |
| Primary Part Number | 71320712-007 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Lockheed Martin Corporation |
| Status | ACTIVE |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
| Features Provided | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND MONOLITHIC |
| Memory Device Type | ROM |
| Terminal Surface Treatment | SOLDER |
| Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| Voltage Rating and Type Per Characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
| Memory Capacity | UNKNOWN |
| Case Outline Source and Designator | D-8 MIL-M-38510 |
| Time Rating Per Chacteristic | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| Terminal Type and Quantity | 20 PRINTED CIRCUIT |
| Inclosure Material | CERAMIC |
| Inclosure Configuration | DUAL-IN-LINE |
| Input Circuit Pattern | 10 INPUT |
| Body Width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| Body Height | 0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN |
| Body Length | 1.060 INCHES MAXIMUM IN |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| ROM/PROM FAMILY 023 | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| 71320712-007 PRIMARY | Lockheed Martin Corporation (USA) |
| 71311301-001 | Lockheed Martin Corporation (USA) |
| AM27S29DMB | Advanced Micro Devices Inc Dba AMD Austin (USA) |
NSN 5962-01-143-5797 is a Microcircuit,memory, manufactured by Lockheed Martin Corporation, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-143-5797 has 4 cross-referenced part numbers: ROM/PROM FAMILY 023 (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)), 71320712-007 (Lockheed Martin Corporation), 71311301-001 (Lockheed Martin Corporation), AM27S29DMB (Advanced Micro Devices Inc Dba AMD Austin).
There are 12 known substitutes for 5962-01-143-5797: 5962-01-084-0312, 5962-01-103-6125, 5962-01-103-6133 and 9 more. Verify interchangeability with system specifications before substitution.
Key specifications for 71320712-007: Operating Temp Range: -55.0 TO 125.0 CELSIUS DEGC; Output Logic Form: TRANSISTOR-TRANSISTOR LOGIC; Features Provided: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND MONOLITHIC; Memory Device Type: ROM. 18 total characteristics are documented in the Federal Logistics Information System.