The Microcircuit,memory, cataloged under National Stock Number 5962-01-181-3107, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Lockheed Martin Corp Dba Lockheed Martin Div Mst - Eagan. Government technical data includes 20 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 14 commercial cross-references from 9 manufacturers, enabling identification through both NSN and commercial part number lookups. 12 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Cancelled.
| Parameter | Value |
|---|---|
| NSN | 5962-01-181-3107 |
| Primary Part Number | 7909914-12 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Lockheed Martin Corp Dba Lockheed Martin Div Mst - Eagan |
| Status | CANCELLED |
| Time Rating Per Chacteristic | 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Inclosure Material | CERAMIC AND GLASS |
| Body Height | 0.185 INCHES NOMINAL IN |
| Test Data Document | 81349-MIL-M-38510 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTING GENERAL TYPE DATA ON CERTAIN ENVIRONMENTAL AND PERFORMANCE REQUIREMENTS AND TEST CONDITIONS THAT ARE SHOWN AS "TYPICAL", "AVERAGE", "NOMINAL", ETC.). |
| Voltage Rating and Type Per Characteristic | 5.0 VOLTS NOMINAL POWER SOURCE |
| Terminal Type and Quantity | 20 PRINTED CIRCUIT |
| Output Logic Form | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
| Inclosure Configuration | DUAL-IN-LINE |
| Features Provided | HERMETICALLY SEALED AND MONOLITHIC AND BIPOLAR |
| Input Circuit Pattern | 12 INPUT |
| Case Outline Source and Designator | D-8 MIL-M-38510 |
| Specification/standard Data | 81349-MIL-M-38510/503 GOVERNMENT SPECIFICATION |
| Body Width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| Terminal Surface Treatment | SOLDER |
| Memory Device Type | PAL |
| Body Length | 1.060 INCHES MAXIMUM IN |
| Maximum Power Dissipation Rating | 2.0 WATTS |
| Current Rating Per Characteristic | 100.00 MILLIAMPERES MAXIMUM OUTPUT SINK |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Acquisition Status | CANCELLED |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| 7909914-12 | Lockheed Martin Corp Dba Lockheed Martin Div Mst - Eagan (USA) |
| PAL12L6 | Mmi/amd (USA) |
| DMPAL12L6J/883 | National Semiconductor Corporation (USA) |
| 644A649H01 | Northrop Grumman Systems Corporation Dba Northrop Grumman Systems Corp (USA) |
| M38510/50307BRA | Military Specifications Promulgated by Military Departments/agencies Under Authority of Defense Standardization Manual 4120 3-M |
| 5962-3850307BRA | Military Specifications Promulgated by Military Departments/agencies Under Authority of Defense Standardization Manual 4120 3-M |
| MIL-M-38510/503 | Military Specifications Promulgated by Military Departments/agencies Under Authority of Defense Standardization Manual 4120 3-M |
| 351-3656-092 | Rockwell Collins, Inc. Dba Collins Aerospace Government Systems Div Collins Aerospace - Government Systems (USA) |
| 5962-3850307BRB | Military Specifications Promulgated by Military Departments/agencies Under Authority of Defense Standardization Manual 4120 3-M |
| PAL12L6 | Advanced Micro Devices Inc Dba AMD Austin (USA) |
| 5962-3850307BRX | Military Specifications Promulgated by Military Departments/agencies Under Authority of Defense Standardization Manual 4120 3-M |
| ROM/PROM HEAD 104 | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| M38510/50307BRB | Military Specifications Promulgated by Military Departments/agencies Under Authority of Defense Standardization Manual 4120 3-M |
| 6405548-1 | Honeywell Intl Inc Defense Avionics Systems Former Test Systems Div (USA) |
NSN 5962-01-181-3107 is a Microcircuit,memory, manufactured by Lockheed Martin Corp Dba Lockheed Martin Div Mst - Eagan, classified under FSC 5962 (No Item Name Available). Status: cancelled.
NSN 5962-01-181-3107 has 14 cross-referenced part numbers: 7909914-12 (Lockheed Martin Corp Dba Lockheed Martin Div Mst - Eagan), PAL12L6 (Mmi/amd), DMPAL12L6J/883 (National Semiconductor Corporation), 644A649H01 (Northrop Grumman Systems Corporation Dba Northrop Grumman Systems Corp), M38510/50307BRA (Military Specifications Promulgated by Military Departments/agencies Under Authority of Defense Standardization Manual 4120 3-M) and 9 more.
There are 12 known substitutes for 5962-01-181-3107: 5962-01-174-1380, 5962-01-181-3831, 5962-01-184-1162 and 9 more. Verify interchangeability with system specifications before substitution.
Key specifications for 7909914-12: Time Rating Per Chacteristic: 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS; Storage Temp Range: -65.0 TO 150.0 CELSIUS DEGC; Inclosure Material: CERAMIC AND GLASS; Body Height: 0.185 INCHES NOMINAL IN. 20 total characteristics are documented in the Federal Logistics Information System.
NSN 5962-01-181-3107 is currently cancelled. Check with the Defense Logistics Agency for current availability and authorized substitutes.