The Microcircuit,memory, cataloged under National Stock Number 5962-01-162-8103, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is L3 Technologies, Inc. Div Communication Systems-West. Government technical data includes 15 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 8 commercial cross-references from 6 manufacturers, enabling identification through both NSN and commercial part number lookups. 12 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Cancelled.
| Parameter | Value |
|---|---|
| NSN | 5962-01-162-8103 |
| Primary Part Number | 21676-07 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | L3 Technologies, Inc. Div Communication Systems-West |
| Status | CANCELLED |
| Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
| Body Height | 0.130 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN |
| Input Circuit Pattern | 12 INPUT |
| Body Length | 0.915 INCHES MAXIMUM IN |
| Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| Voltage Rating and Type Per Characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
| Memory Device Type | ROM |
| Terminal Surface Treatment | SOLDER |
| Terminal Type and Quantity | 18 PRINTED CIRCUIT |
| Features Provided | SCHOTTKY AND W/ENABLE AND 3-STATE OUTPUT |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Body Width | 0.290 INCHES MAXIMUM IN |
| Inclosure Configuration | DUAL-IN-LINE |
| Inclosure Material | CERAMIC |
| Acquisition Status | CANCELLED |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| HM1-7643-8 | Renesas Electronics America Inc (USA) |
| 21676-07 PRIMARY | L3 Technologies, Inc. Div Communication Systems-West (USA) |
| ROM/PROM FAMILY 030 | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| S82S137I/883B | Philips Semiconductors Inc (USA) |
| MM5353-1D/883B | Mmi/amd (USA) |
| MM5353D/883B | Mmi/amd (USA) |
| S82S137F/883B | Philips Semiconductors Inc (USA) |
| DM54S573J/883 | National Semiconductor Corporation (USA) |
NSN 5962-01-162-8103 is a Microcircuit,memory, manufactured by L3 Technologies, Inc. Div Communication Systems-West, classified under FSC 5962 (No Item Name Available). Status: cancelled.
NSN 5962-01-162-8103 has 8 cross-referenced part numbers: HM1-7643-8 (Renesas Electronics America Inc), 21676-07 (L3 Technologies, Inc. Div Communication Systems-West), ROM/PROM FAMILY 030 (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)), S82S137I/883B (Philips Semiconductors Inc), MM5353-1D/883B (Mmi/amd) and 3 more.
There are 12 known substitutes for 5962-01-162-8103: 5962-01-051-2113, 5962-01-099-6382, 5962-01-099-6383 and 9 more. Verify interchangeability with system specifications before substitution.
Key specifications for 21676-07: Output Logic Form: TRANSISTOR-TRANSISTOR LOGIC; Body Height: 0.130 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN; Input Circuit Pattern: 12 INPUT; Body Length: 0.915 INCHES MAXIMUM IN. 15 total characteristics are documented in the Federal Logistics Information System.
NSN 5962-01-162-8103 is currently cancelled. Check with the Defense Logistics Agency for current availability and authorized substitutes.