The Microcircuit,memory, cataloged under National Stock Number 5962-01-139-3211, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is L3 Technologies, Inc. Div Communication Systems-West. Government technical data includes 16 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 15 commercial cross-references from 6 manufacturers, enabling identification through both NSN and commercial part number lookups. 12 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Cancelled.
| Parameter | Value |
|---|---|
| NSN | 5962-01-139-3211 |
| Primary Part Number | 21676-01 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | L3 Technologies, Inc. Div Communication Systems-West |
| Status | CANCELLED |
| Input Circuit Pattern | 12 INPUT |
| Body Width | 0.302 INCHES MAXIMUM IN |
| Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| Memory Device Type | ROM |
| Terminal Type and Quantity | 18 PRINTED CIRCUIT |
| Terminal Surface Treatment | SOLDER |
| Voltage Rating and Type Per Characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
| Maximum Power Dissipation Rating | 0.13 MILLIWATTS |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Features Provided | BIPOLAR AND PROGRAMMABLE AND W/ENABLE AND MONOLITHIC AND 3-STATE OUTPUT |
| Body Height | 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Body Length | 0.882 INCHES MINIMUM AND 0.925 INCHES MAXIMUM IN |
| Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
| Inclosure Configuration | DUAL-IN-LINE |
| Inclosure Material | CERAMIC |
| Acquisition Status | CANCELLED |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| S82S137I/883B | Philips Semiconductors Inc (USA) |
| MM5353D/883B | Mmi/amd (USA) |
| 21008-01 | National Semiconductor Corporation (USA) |
| 21008-01 | Renesas Electronics America Inc (USA) |
| DM54S573J/883B | National Semiconductor Corporation (USA) |
| SCD15522 | L3 Technologies, Inc. Div Communication Systems-West (USA) |
| 15522 | L3 Technologies, Inc. Div Communication Systems-West (USA) |
| 21676-01 PRIMARY | L3 Technologies, Inc. Div Communication Systems-West (USA) |
| ROM/PROM FAMILY 030 | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| 21008-01 | Mmi/amd (USA) |
| 21008-01 | Philips Semiconductors Inc (USA) |
| 21008-01 | L3 Technologies, Inc. Div Communication Systems-West (USA) |
| HM1-7643-8 | Renesas Electronics America Inc (USA) |
| S82S137F/883B | Philips Semiconductors Inc (USA) |
| MM5353-1D/883B | Mmi/amd (USA) |
NSN 5962-01-139-3211 is a Microcircuit,memory, manufactured by L3 Technologies, Inc. Div Communication Systems-West, classified under FSC 5962 (No Item Name Available). Status: cancelled.
NSN 5962-01-139-3211 has 15 cross-referenced part numbers: S82S137I/883B (Philips Semiconductors Inc), MM5353D/883B (Mmi/amd), 21008-01 (National Semiconductor Corporation), 21008-01 (Renesas Electronics America Inc), DM54S573J/883B (National Semiconductor Corporation) and 10 more.
There are 12 known substitutes for 5962-01-139-3211: 5950-00-087-5534, 4330-00-218-5479, 5110-00-253-3167 and 9 more. Verify interchangeability with system specifications before substitution.
Key specifications for 21676-01: Input Circuit Pattern: 12 INPUT; Body Width: 0.302 INCHES MAXIMUM IN; Test Data Document: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).; Memory Device Type: ROM. 17 total characteristics are documented in the Federal Logistics Information System.
NSN 5962-01-139-3211 is currently cancelled. Check with the Defense Logistics Agency for current availability and authorized substitutes.