The Microcircuit,memory, cataloged under National Stock Number 5962-01-140-1659, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Lockheed Martin Corporation Dba Lockheed Martin Div Rotary and Mission Systems. Government technical data includes 17 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 2 commercial cross-references from 2 manufacturers, enabling identification through both NSN and commercial part number lookups. 8 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Cancelled.
| Parameter | Value |
|---|---|
| NSN | 5962-01-140-1659 |
| Primary Part Number | 3150740-936-103 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Lockheed Martin Corporation Dba Lockheed Martin Div Rotary and Mission Systems |
| Status | CANCELLED |
| Inclosure Configuration | DUAL-IN-LINE |
| Maximum Power Dissipation Rating | 595.0 MILLIWATTS |
| Terminal Type and Quantity | 24 PRINTED CIRCUIT |
| Memory Device Type | ROM |
| Terminal Surface Treatment | SOLDER |
| Memory Capacity | UNKNOWN |
| Time Rating Per Chacteristic | 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| Voltage Rating and Type Per Characteristic | -0.3 VOLTS MINIMUM POWER SOURCE AND 20.0 VOLTS MAXIMUM POWER SOURCE |
| Features Provided | PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND HIGH SPEED AND STATIC OPERATION |
| Operating Temp Range | +0.0 TO 70.0 CELSIUS DEGC |
| Storage Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Inclosure Material | CERAMIC |
| Body Length | 1.235 INCHES MINIMUM AND 1.290 INCHES MAXIMUM IN |
| Output Logic Form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| Input Circuit Pattern | 12 INPUT |
| Body Width | 0.515 INCHES MINIMUM AND 0.560 INCHES MAXIMUM IN |
| Body Height | 0.145 INCHES MINIMUM AND 0.187 INCHES MAXIMUM IN |
| Acquisition Status | CANCELLED |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| 3150740-936-103 PRIMARY | Lockheed Martin Corporation Dba Lockheed Martin Div Rotary and Mission Systems (USA) |
| ROM/PROM FAMILY 009 | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
NSN 5962-01-140-1659 is a Microcircuit,memory, manufactured by Lockheed Martin Corporation Dba Lockheed Martin Div Rotary and Mission Systems, classified under FSC 5962 (No Item Name Available). Status: cancelled.
NSN 5962-01-140-1659 has 2 cross-referenced part numbers: 3150740-936-103 (Lockheed Martin Corporation Dba Lockheed Martin Div Rotary and Mission Systems), ROM/PROM FAMILY 009 (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)).
There are 8 known substitutes for 5962-01-140-1659: 5962-01-140-1653, 5962-01-140-1654, 5962-01-140-1655 and 5 more. Verify interchangeability with system specifications before substitution.
Key specifications for 3150740-936-103: Inclosure Configuration: DUAL-IN-LINE; Maximum Power Dissipation Rating: 595.0 MILLIWATTS; Terminal Type and Quantity: 24 PRINTED CIRCUIT; Memory Device Type: ROM. 17 total characteristics are documented in the Federal Logistics Information System.
NSN 5962-01-140-1659 is currently cancelled. Check with the Defense Logistics Agency for current availability and authorized substitutes.