Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: 3150740-936-103

3150740-936-103 ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.515 INCHES MINIMUM AND 0.560 INCHES MAXIMUM IN, body_height: 0.145 INCHES MINIMUM AND 0.187 INCHES MAXIMUM IN, body_length: 1.235 INCHES MINIMUM AND 1.290 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND HIGH SPEED AND STATIC OPERATION, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-140-1659, indicating validated use in U.S.

government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

3150740-936-103

NSN: 5962-01-140-1659
FSC: 5962
CAGE: 25500 — LOCKHEED MARTIN CORPORATION DBA LOCKHEED MARTIN DIV ROTARY AND MISSION SYSTEMS (USA)

SPECIFICATIONS

body_width	0.515 INCHES MINIMUM AND 0.560 INCHES MAXIMUM IN
body_height	0.145 INCHES MINIMUM AND 0.187 INCHES MAXIMUM IN
body_length	1.235 INCHES MINIMUM AND 1.290 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND HIGH SPEED AND STATIC OPERATION
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-55.0 TO 125.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	12 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-140-1659

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MAXIMUM POWER DISSIPATION RATING: 595.0 MILLIWATTS

•

TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT

•

MEMORY DEVICE TYPE: ROM

•

TERMINAL SURFACE TREATMENT: SOLDER

•

MEMORY CAPACITY: UNKNOWN

•

TIME RATING PER CHACTERISTIC: 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.3 VOLTS MINIMUM POWER SOURCE AND 20.0 VOLTS MAXIMUM POWER SOURCE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

INCLOSURE CONFIGURATION	DUAL-IN-LINE
MAXIMUM POWER DISSIPATION RATING	595.0 MILLIWATTS
TERMINAL TYPE AND QUANTITY	24 PRINTED CIRCUIT
MEMORY DEVICE TYPE	ROM
TERMINAL SURFACE TREATMENT	SOLDER
MEMORY CAPACITY	UNKNOWN
TIME RATING PER CHACTERISTIC	120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	-0.3 VOLTS MINIMUM POWER SOURCE AND 20.0 VOLTS MAXIMUM POWER SOURCE
FEATURES PROVIDED	PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND HIGH SPEED AND STATIC OPERATION
OPERATING TEMP RANGE	+0.0 TO 70.0 CELSIUS DEGC

VERIFIED SUBSTITUTES & CROSS-REFERENCES 12

3150740-930-103Interchangeable