The Microcircuit,memory, cataloged under National Stock Number 5962-01-099-5902, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is General Dynamics Advanced Information Systems Inc. Dba General Dynamics Advanced Information Systems. Government technical data includes 18 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 5 commercial cross-references from 4 manufacturers, enabling identification through both NSN and commercial part number lookups. 12 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-099-5902 |
| Primary Part Number | 15-1242451-3 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | General Dynamics Advanced Information Systems Inc. Dba General Dynamics Advanced Information Systems |
| Status | ACTIVE |
| Inclosure Material | CERAMIC |
| Memory Device Type | EPROM |
| Voltage Rating and Type Per Characteristic | 20.0 VOLTS MAXIMUM POWER SOURCE |
| Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| Terminal Surface Treatment | SOLDER |
| Terminal Type and Quantity | 24 PRINTED CIRCUIT |
| Time Rating Per Chacteristic | 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| Memory Capacity | UNKNOWN |
| Body Height | 0.175 INCHES MAXIMUM IN |
| Input Circuit Pattern | 11 INPUT |
| Body Length | 1.285 INCHES MAXIMUM IN |
| Storage Temp Range | -65.0 TO 125.0 CELSIUS DEGC |
| Output Logic Form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| Inclosure Configuration | DUAL-IN-LINE |
| Body Width | 0.600 INCHES MAXIMUM IN |
| Operating Temp Range | -55.0 TO 100.0 CELSIUS DEGC |
| Maximum Power Dissipation Rating | 1.8 WATTS |
| Features Provided | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND W/ENABLE AND 3-STATE OUTPUT |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| 15-1242451-3 | General Dynamics Advanced Information Systems Inc. Dba General Dynamics Advanced Information Systems (USA) |
| AM9708DMB | Advanced Micro Devices Inc Dba AMD Austin (USA) |
| ROM/PROM FAMILY 014 | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| MD2708/B | Intel Corp Sales Office (USA) |
| 15-1216657-30 | General Dynamics Advanced Information Systems Inc. Dba General Dynamics Advanced Information Systems (USA) |
NSN 5962-01-099-5902 is a Microcircuit,memory, manufactured by General Dynamics Advanced Information Systems Inc. Dba General Dynamics Advanced Information Systems, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-099-5902 has 5 cross-referenced part numbers: 15-1242451-3 (General Dynamics Advanced Information Systems Inc. Dba General Dynamics Advanced Information Systems), AM9708DMB (Advanced Micro Devices Inc Dba AMD Austin), ROM/PROM FAMILY 014 (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)), MD2708/B (Intel Corp Sales Office), 15-1216657-30 (General Dynamics Advanced Information Systems Inc. Dba General Dynamics Advanced Information Systems).
There are 12 known substitutes for 5962-01-099-5902: 5962-01-047-2035, 5962-01-099-5903, 5962-01-100-5610 and 9 more. Verify interchangeability with system specifications before substitution.
Key specifications for 15-1242451-3: Inclosure Material: CERAMIC; Memory Device Type: EPROM; Voltage Rating and Type Per Characteristic: 20.0 VOLTS MAXIMUM POWER SOURCE; Test Data Document: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).. 18 total characteristics are documented in the Federal Logistics Information System.