MD2708/B — Technical Data Sheet

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— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN, body_height: 0.217 INCHES MAXIMUM IN, body_length: 1.235 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND W/ENABLE, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-047-2035, indicating validated use in U.S.

government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

MD2708/B

NSN: 5962-01-047-2035
FSC: 5962
CAGE: 34649 — INTEL CORP SALES OFFICE (USA)

SPECIFICATIONS

body_width	0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
body_height	0.217 INCHES MAXIMUM IN
body_length	1.235 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND W/ENABLE
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	EPROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	11 INPUT
NSN	5962-01-047-2035

COMPONENT DIAGRAM

KEY FEATURES

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INCLOSURE MATERIAL: CERAMIC AND METAL

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INCLOSURE CONFIGURATION: DUAL-IN-LINE

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TERMINAL SURFACE TREATMENT: SOLDER

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MEMORY CAPACITY: UNKNOWN

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TIME RATING PER CHACTERISTIC: 20.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 20.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS

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TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

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MEMORY DEVICE TYPE: ROM

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VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 15.0 VOLTS MAXIMUM POWER SOURCE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

INCLOSURE MATERIAL	CERAMIC AND METAL
INCLOSURE CONFIGURATION	DUAL-IN-LINE
TERMINAL SURFACE TREATMENT	SOLDER
MEMORY CAPACITY	UNKNOWN
TIME RATING PER CHACTERISTIC	20.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 20.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
MEMORY DEVICE TYPE	ROM
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	15.0 VOLTS MAXIMUM POWER SOURCE
TERMINAL TYPE AND QUANTITY	24 PRINTED CIRCUIT
BODY WIDTH	0.500 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN

VERIFIED SUBSTITUTES & CROSS-REFERENCES 27

95-00274-004Interchangeable