The Microcircuit,memory, cataloged under National Stock Number 5962-01-080-1669, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Us Army Communications & Electronics Materiel Readiness Command Logistics Engineering Dir. Government technical data includes 15 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 6 commercial cross-references from 5 manufacturers, enabling identification through both NSN and commercial part number lookups. 9 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-080-1669 |
| Primary Part Number | SM-A-917150-1 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Us Army Communications & Electronics Materiel Readiness Command Logistics Engineering Dir |
| Status | ACTIVE |
| Inclosure Configuration | DUAL-IN-LINE |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Body Length | 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |
| Inclosure Material | CERAMIC AND GLASS |
| Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
| Voltage Rating and Type Per Characteristic | 5.5 VOLTS MAXIMUM POWER SOURCE |
| Terminal Type and Quantity | 16 PRINTED CIRCUIT |
| Memory Device Type | ROM |
| Test Data Document | 80063-SM-A-917150 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| Terminal Surface Treatment | SOLDER |
| Features Provided | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND 3-STATE OUTPUT AND PROGRAMMABLE AND W/ENABLE AND SCHOTTKY |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Body Height | 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN |
| Body Width | 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN |
| Input Circuit Pattern | 6 INPUT |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| SM-A-917150-1 | Philips Semiconductors Inc (USA) |
| S82S123F/883B | Philips Semiconductors Inc (USA) |
| ROM/PROM FAMILY 013 | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| SM-A-917150-1 PRIMARY | Us Army Communications & Electronics Materiel Readiness Command Logistics Engineering Dir (USA) |
| SM-A-917150-1 | Lockheed Martin Corporation Dba Lockheed Martin Div Lockheed Martin (USA) |
| 6100-3 | L3 Technologies, Inc. Div Communication Systems-West (USA) |
NSN 5962-01-080-1669 is a Microcircuit,memory, manufactured by Us Army Communications & Electronics Materiel Readiness Command Logistics Engineering Dir, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-080-1669 has 6 cross-referenced part numbers: SM-A-917150-1 (Philips Semiconductors Inc), S82S123F/883B (Philips Semiconductors Inc), ROM/PROM FAMILY 013 (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)), SM-A-917150-1 (Us Army Communications & Electronics Materiel Readiness Command Logistics Engineering Dir), SM-A-917150-1 (Lockheed Martin Corporation Dba Lockheed Martin Div Lockheed Martin) and 1 more.
There are 9 known substitutes for 5962-01-080-1669: 5905-00-228-0723, 4730-00-257-2117, 3030-00-264-3057 and 6 more. Verify interchangeability with system specifications before substitution.
Key specifications for SM-A-917150-1: Inclosure Configuration: DUAL-IN-LINE; Storage Temp Range: -65.0 TO 150.0 CELSIUS DEGC; Body Length: 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN; Inclosure Material: CERAMIC AND GLASS. 15 total characteristics are documented in the Federal Logistics Information System.