The Microcircuit,memory, cataloged under National Stock Number 5962-01-078-1814, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Northrop Grumman Systems Corporation Dba Northrop Grumman Systems Corp Div Multiple. Government technical data includes 19 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 16 commercial cross-references from 11 manufacturers, enabling identification through both NSN and commercial part number lookups. 7 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-078-1814 |
| Primary Part Number | 058-002131-001 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Northrop Grumman Systems Corporation Dba Northrop Grumman Systems Corp Div Multiple |
| Status | ACTIVE |
| Inclosure Material | CERAMIC AND GLASS |
| Memory Device Type | ROM |
| Voltage Rating and Type Per Characteristic | 5.5 VOLTS MAXIMUM POWER SOURCE |
| Test Data Document | 26916-058-002131 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| Time Rating Per Chacteristic | 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| Memory Capacity | UNKNOWN |
| Terminal Type and Quantity | 16 FLAT LEADS |
| Case Outline Source and Designator | -0-001-AG JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| Terminal Surface Treatment | SOLDER |
| Body Height | 0.120 INCHES MINIMUM AND 0.195 INCHES MAXIMUM IN |
| Input Circuit Pattern | 6 INPUT |
| Maximum Power Dissipation Rating | 512.0 MILLIWATTS |
| Body Length | 0.750 INCHES MINIMUM AND 0.795 INCHES MAXIMUM IN |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
| Body Width | 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Inclosure Configuration | DUAL-IN-LINE |
| Features Provided | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND SCHOTTKY AND 3-STATE OUTPUT AND W/DECODED OUTPUT AND PROGRAMMABLE AND PROGRAMMED AND W/ENABLE AND W/DISABLE |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| 058-002131-001 | Philips Semiconductors Inc (USA) |
| SN74S288J | Texas Instruments Incorporated (USA) |
| 058-002131-001 | Renesas Electronics America Inc (USA) |
| 115370-0003 | Thales Usa, Inc. Div Air Mobility Solutions ("ams") (USA) |
| S82S123F/883B | Philips Semiconductors Inc (USA) |
| 803835-1 | Raytheon Company Dba Raytheon (USA) |
| ROM/PROM FAMILY 013 | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| 058-002131-001 | National Semiconductor Corporation (USA) |
| 28721-41001 | Leonardo Mw Ltd (GBR) |
| 058-002018 | Northrop Grumman Systems Corporation Dba Northrop Grumman Systems Corp Div Multiple (USA) |
| AM27S09DC | Advanced Micro Devices Inc Dba AMD Austin (USA) |
| DM54S288J/883 | National Semiconductor Corporation (USA) |
| 058-002131-001 | Texas Instruments Incorporated (USA) |
| 058-002131-001 PRIMARY | Northrop Grumman Systems Corporation Dba Northrop Grumman Systems Corp Div Multiple (USA) |
| HM1-7603-8 | Renesas Electronics America Inc (USA) |
| 28721-41001 | Leonardo Uk Ltd (GBR) |
NSN 5962-01-078-1814 is a Microcircuit,memory, manufactured by Northrop Grumman Systems Corporation Dba Northrop Grumman Systems Corp Div Multiple, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-078-1814 has 16 cross-referenced part numbers: 058-002131-001 (Philips Semiconductors Inc), SN74S288J (Texas Instruments Incorporated), 058-002131-001 (Renesas Electronics America Inc), 115370-0003 (Thales Usa, Inc. Div Air Mobility Solutions ("ams")), S82S123F/883B (Philips Semiconductors Inc) and 11 more.
There are 7 known substitutes for 5962-01-078-1814: 5962-01-114-2074, 5962-01-114-2075, 5962-01-135-1555 and 4 more. Verify interchangeability with system specifications before substitution.
Key specifications for 058-002131-001: Inclosure Material: CERAMIC AND GLASS; Memory Device Type: ROM; Voltage Rating and Type Per Characteristic: 5.5 VOLTS MAXIMUM POWER SOURCE; Test Data Document: 26916-058-002131 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING). 19 total characteristics are documented in the Federal Logistics Information System.