The Microcircuit,memory, cataloged under National Stock Number 5962-01-047-6642, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Us Army Communications & Electronics Materiel Readiness Command Logistics Engineering Dir. Government technical data includes 14 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 6 commercial cross-references from 4 manufacturers, enabling identification through both NSN and commercial part number lookups. 10 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-047-6642 |
| Primary Part Number | SM-A-917150-9 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Us Army Communications & Electronics Materiel Readiness Command Logistics Engineering Dir |
| Status | ACTIVE |
| Body Height | 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN |
| Inclosure Configuration | DUAL-IN-LINE |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
| Voltage Rating and Type Per Characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
| Memory Device Type | ROM |
| Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| Terminal Type and Quantity | 16 PRINTED CIRCUIT |
| Body Length | 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |
| Input Circuit Pattern | 6 INPUT |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Body Width | 0.302 INCHES MAXIMUM IN |
| Inclosure Material | CERAMIC |
| Features Provided | PROGRAMMABLE AND 3-STATE OUTPUT AND W/ENABLE AND MONOLITHIC AND HERMETICALLY SEALED AND BIPOLAR |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| S82S123F/883B | Philips Semiconductors Inc (USA) |
| SM-A-917150-9 PRIMARY | Us Army Communications & Electronics Materiel Readiness Command Logistics Engineering Dir (USA) |
| 6130-0 | Us Army Communications & Electronics Materiel Readiness Command Logistics Engineering Dir (USA) |
| ROM/PROM FAMILY 013 | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| SM-A-699714-55 | L3 Technologies, Inc. Div Communication Systems-West (USA) |
| 6130-0 | L3 Technologies, Inc. Div Communication Systems-West (USA) |
NSN 5962-01-047-6642 is a Microcircuit,memory, manufactured by Us Army Communications & Electronics Materiel Readiness Command Logistics Engineering Dir, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-047-6642 has 6 cross-referenced part numbers: S82S123F/883B (Philips Semiconductors Inc), SM-A-917150-9 (Us Army Communications & Electronics Materiel Readiness Command Logistics Engineering Dir), 6130-0 (Us Army Communications & Electronics Materiel Readiness Command Logistics Engineering Dir), ROM/PROM FAMILY 013 (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)), SM-A-699714-55 (L3 Technologies, Inc. Div Communication Systems-West) and 1 more.
There are 10 known substitutes for 5962-01-047-6642: 5970-00-117-5353, 5985-00-434-4987, 5945-00-556-3705 and 7 more. Verify interchangeability with system specifications before substitution.
Key specifications for SM-A-917150-9: Overall Height: 0.290 INCHES MINIMUM AND 0.380 INCHES MAXIMUM IN; Body Height: 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN; Inclosure Configuration: DUAL-IN-LINE; Storage Temp Range: -65.0 TO 150.0 CELSIUS DEGC. 15 total characteristics are documented in the Federal Logistics Information System.