The Semiconductor Device,diode, cataloged under National Stock Number 5961-00-252-1309, is classified within Federal Supply Class 5961 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Pultz John M Co Inc. Government technical data includes 11 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 50 commercial cross-references from 36 manufacturers, enabling identification through both NSN and commercial part number lookups. 11 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Cancelled.
| Parameter | Value |
|---|---|
| NSN | 5961-00-252-1309 |
| Primary Part Number | P58-005773-003 |
| Item Name | Semiconductor Device,diode |
| FSC / FSG | 5961 / 59 — No Item Name Available |
| Manufacturer | Pultz John M Co Inc |
| Status | CANCELLED |
| Maximum Operating Temp Per Measurement Point | 200.0 CELSIUS AMBIENT AIR DEGC |
| Material | SILICON SEMICONDUCTOR |
| Power Rating Per Characteristic | 250.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION |
| Overall Diameter | 0.016 INCHES MINIMUM IN |
| Current Rating Per Characteristic | 10.00 MICROAMPERES MAXIMUM FORWARD CURRENT, DC |
| Features Provided | HERMETICALLY SEALED CASE |
| Terminal Length | 1.000 INCHES MINIMUM IN |
| Mounting Method | TERMINAL |
| Voltage Rating in Volts Per Characteristic | -70.0 MAXIMUM BREAKDOWN VOLTAGE, DC |
| Material | GLASS ENCLOSURE |
| Terminal Type and Quantity | 2 UNINSULATED WIRE LEAD |
| Acquisition Status | CANCELLED |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| B162003-0000 | Butler National Corp (USA) |
| 600062-06 | Edo (USA) |
| HP82-2800 | Hewlett-Packard Company Dba HP (USA) |
| 48P16044A-001P | Bastogi Sistemi Spa (ITA) |
| P58-005773-003 PRIMARY | Pultz John M Co Inc (USA) |
| 619174-1 PRIMARY | Raytheon Company (USA) |
| 177-5020 | Rs Components SAS (FRA) |
| 41145-106-00-5 | British Aerospace Defence Systems Ltd T/a Bae Systems (GBR) |
| 505-106 | Plath Gmbh & Co. Kg (DEU) |
| 5082-2800 PRIMARY | Hewlett-Packard Company Dba HP (USA) |
| 511785-1 | L3harris Technologies, Inc. Dba Harris Corporation (USA) |
| 5082-8906 | Hewlett-Packard Company Dba HP (USA) |
| 499-042-095 | L3harris Interstate Electronics Corporation (USA) |
| 5L.5532.102.36 | Hensoldt Sensors Gmbh Div Seps (DEU) |
| 533474-1 | Raytheon Company Dba Raytheon (USA) |
| 5082-2677 | Avago Technologies Us Inc Div Avago Technologies (USA) |
| 5082-2883 | Hewlett-Packard Company Dba HP (USA) |
| 415-9-98532 | British Aerospace Land & Sea Systems, Post Design Services (GBR) |
| B914304 | Raytheon Systems Ltd (GBR) |
| 32 869-001 | Rockwell Collins Deutschland Gmbh Div Rockwell Collins International & Service Solutions (DEU) |
NSN 5961-00-252-1309 is a Semiconductor Device,diode, manufactured by Pultz John M Co Inc, classified under FSC 5961 (No Item Name Available). Status: cancelled.
NSN 5961-00-252-1309 has 50 cross-referenced part numbers: B162003-0000 (Butler National Corp), 600062-06 (Edo), HP82-2800 (Hewlett-Packard Company Dba HP), 48P16044A-001P (Bastogi Sistemi Spa), P58-005773-003 (Pultz John M Co Inc) and 45 more.
There are 11 known substitutes for 5961-00-252-1309: 5961-00-147-9743, 5961-00-172-0712, 5961-00-232-3279 and 8 more. Verify interchangeability with system specifications before substitution.
Key specifications for P58-005773-003: Maximum Operating Temp Per Measurement Point: 200.0 CELSIUS AMBIENT AIR DEGC; Material: SILICON SEMICONDUCTOR; Power Rating Per Characteristic: 250.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION; Overall Diameter: 0.016 INCHES MINIMUM IN. 12 total characteristics are documented in the Federal Logistics Information System.
NSN 5961-00-252-1309 is currently cancelled. Check with the Defense Logistics Agency for current availability and authorized substitutes.